David J. Elliott

Wafer Edge Bead Cleaning with Laser Radiation and Reactive Gas

The purpose of this study is to investigate and optimize the process parameters for cleaning the top, bottom, and apex edges of silicon wafers using laser radiation and reactive gas. A secondary purpose is to conduct photoresist edge bead and post-etch polymer film removal (EBR) experiments to determine the minimum controllable edge exclusion in EBR processing to improve die yield. [ An overall purpose is to identify a robust and environmentally sound process for wafer edge cleaning and a hardware configuration (stand alone or track integrated) that can be cost effectively produced for device manufacturing.