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David T. Or

Applied Materials

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Archive | 1999

300 mm CVD chamber design for metal-organic thin film deposition

David T. Or; Keith K. Koai; Fufa Chen; Lawrence C. Lei

Archive | 2005

In-situ chamber clean process to remove by-product deposits from chemical vapor etch chamber

David T. Or; Jing-Pei Chou; See-Eng Phan; Xinliang Lu; Chien-Teh Kao; Mei Chang

Archive | 2008

Selective etching of silicon nitride

Xinlaing Lu; Haichun Yang; Zhenbin Ge; Nan Lu; David T. Or; Chien-Teh Kao; Mei Chang

Archive | 2008

Nf3/h2 remote plasma process with high etch selectivity of psg/bpsg over thermal oxide and low density surface defects

Chien-Teh Kao; Xinliang Lu; Haichun Yang; Zhenbin Ge; David T. Or; Mei Chang

Archive | 2002

Reduced friction lift pin

David T. Or; Keith K. Koai; Hiroyuki Takahama; Takahiro Ito; Koji Ota; Hiroshi Sato

Archive | 1997

Magnetron with cooling system for process chamber of processing system

David T. Or; David Datong Huo; J. Darrel Stickler

Archive | 2006

Substrate support lift mechanism

Eric W. Schieve; Keith K. Koai; David T. Or; Rene T. Correa

Archive | 2013

Directional SiO2 etch using plasma pre-treatment and high-temperature etchant deposition

David T. Or; Joshua Collins; Mei Chang

Archive | 2011

PROCESS CHAMBER LID DESIGN WITH BUILT-IN PLASMA SOURCE FOR SHORT LIFETIME SPECIES

Chien-Teh Kao; Hyman W. H. Lam; Mei Chang; David T. Or; Nicholas R. Denny; Xiaoxiong Yuan

Archive | 2006

Substrate support lift pin

David T. Or; Keith K. Koai; Hiroyuki Takahama; Takahiro Ito; Koji Ota; Hiroshi Sato

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