Denis Striakhilev

Amorphous silicon thin film transistor circuit integration for organic LED displays on glass and plastic

This paper presents design considerations along with measurement results pertinent to hydrogenated amorphous silicon (a-Si:H) thin film transistor (TFT) drive circuits for active matrix organic light emitting diode (AMOLED) displays. We describe both pixel architectures and TFT circuit topologies that are amenable for vertically integrated, high aperture ratio pixels. Here, the OLED layer is integrated directly above the TFT circuit layer, to provide an active pixel area that is at least 90% of the total pixel area with an aperture ratio that remains virtually independent of scaling. Both voltage-programmed and current-programmed drive circuits are considered. The latter provides compensation for shifts in device characteristics due to metastable shifts in the threshold voltage of the TFT. Various drive circuits on glass and plastic were fabricated and tested. Integration of on-panel gate drivers is also discussed where we present the architecture of an a-Si:H based gate de-multiplexer that is threshold voltage shift invariant. In addition, a programmable current mirror with good linearity and stability is presented. Programmable current sources are an essential requirement in the design of source driver output stages.

Low-Temperature Materials and Thin Film Transistors for Flexible Electronics

This paper addresses the low-temperature deposition processes and electronic properties of silicon based thin film semiconductors and dielectrics to enable the fabrication of mechanically flexible electronic devices on plastic substrates. Device quality amorphous hydrogenated silicon (a-Si:H), nanocrystalline silicon (nc-Si), and amorphous silicon nitride (a-SiN/sub x/) films and thin film transistors (TFTs) were made using existing industrial plasma deposition equipment at the process temperatures as low as 75/spl deg/C and 120/spl deg/C. The a-Si:H TFTs fabricated at 120/spl deg/C demonstrate performance similar to their high-temperature counterparts, including the field effect mobility (/spl mu//sub FE/) of 0.8 cm/sup 2/V/sup -1/s/sup -1/, the threshold voltage (V/sub T/) of 4.5 V, and the subthreshold slope of 0.5 V/dec, and can be used in active matrix (AM) displays including organic light emitting diode (OLED) displays. The a-Si:H TFTs fabricated at 75/spl deg/C exhibit /spl mu//sub FE/ of 0.6 cm/sup 2/V/sup -1/s/sup -1/, and V/sub T/ of 4 V. It is shown that further improvement in TFT performance can be achieved by using n/sup +/ nc-Si contact layers and plasma treatments of the interface between the gate dielectric and the channel layer. The results demonstrate that with appropriate process optimization, the large area thin film Si technology suits well the fabrication of electronic devices on low-cost plastic substrates.

Above-threshold parameter extraction and modeling for amorphous silicon thin-film transistors

This paper presents modeling and parameter extraction of the above-threshold characteristics of hydrogenated amorphous silicon (a-Si:H) thin-film transistors (TFTs) in both linear and saturation regions of operation. A bias- and geometry-independent definition for field effect mobility considering the ratio of free-to-trapped carriers is introduced, which conveys the properties of the active semiconducting layer. A method for extraction of model parameters such as threshold voltage, effective mobility, band-tail slope, and contact resistance from the measurement results is presented. This not only provides insight to the device properties, which are highly fabrication-dependent, but also enables accurate and reliable TFT circuit simulation. The techniques presented here form the basis for extraction of physical parameters for other TFTs with similar gap properties, such as organic and polymer TFTs.

Stability of nc-Si:H TFTs With Silicon Nitride Gate Dielectric

We report the fabrication and characterization of bottom-gate and top-gate nanocrystalline silicon (nc-Si:H) thin-film transistors (TFTs) with amorphous-silicon nitride (a-SiNx:H) as the gate dielectric. The devices were fabricated using standard 13.56-MHz plasma-enhanced chemical vapor deposition at 240 degC. Here, the same 80-nm nc-Si:H channel, 300-nm a-SiNx:H gate dielectric, and 60-nm n+ nc-Si:H ohmic contact layers were used in both TFT structures. We analyzed the effects of gate configuration on TFT performance and, in particular, the electrical stability. The stability tests were carried out at a gate bias stress in the range from 20 to 40 V. The nc-Si:H TFTs demonstrated much better threshold-voltage (VT ) stability compared with the amorphous-silicon (a-Si:H) counterparts, offering great promise for applications in active-matrix organic light-emitting diode (AMOLED) displays

P-25: A New Driving Method for a-Si AMOLED Displays Based on Voltage Feedback

We present a new driving technique for active-matrix organic light-emitting diode displays using amorphous silicon backplanes. The technique uses voltage feedback to compensate for threshold voltage shift of TFTs. Measurement results show less than 3.5% change in OLED current over 2700 hours of bias stress.

Backplane Requirements for Active Matrix Organic Light Emitting Diode Displays

Organic light emitting diode (OLED) displays are a serious competitor to liquid crystal displays in view of their superior picture quality, higher contrast, faster on/off response, thinner profile, and high power efficiency. For large area and/or high-resolution applications, an active matrix OLED (AMOLED) addressing scheme is vital. The active matrix backplane can be made with amorphous silicon (a-Si), polysilicon, or organic technology, all of which suffer from threshold voltage shift and/or mismatch problems, causing temporal or spatial variations in the OLED brightness. In addition, the efficiency of the OLED itself degrades over time. Despite these shortcomings, there has been considerable progress in development of AMOLED displays using circuit solutions engineered to provide stable and uniform brightness. Indeed the design of AMOLED pixel circuits, particularly in low-mobility TFT technologies such as a-Si, is challenging due to the stringent requirements of timing, current matching, and low voltage operation. While circuit solutions are necessary, they are not sufficient. Process improvements to enhance TFT performance are becoming inevitable. This paper will review pertinent material requirements of AMOLED backplanes along with design considerations that address pixel architecture, contact resistance, and more importantly, the threshold voltage stability and associated gate overdrive voltage. In particular, we address the question of whether conventional PECVD can be deployed for high mobility and high stability TFTs, and if micro-/nano-crystalline silicon could provide the solution.

46.1: Invited Paper: a‐Si for AMOLED — Meeting the Performance and Cost Demands of Display Applications (Cell Phone to HDTV)

Amorphous silicon AMOLED displays are almost ready for mass production and will be found in all display applications from high resolution cell phone to HDTV. But before commercialization can occur, the problems of lifetime and image sticking need to be overcome. When it comes to pixel circuit design, there is no one-size-fits-all solution. Several drive schemes and pixel circuits are presented, each with unique advantages, and each suited for a particular application. All leverage amorphous silicon manufacturing infrastructure which leads to the lowest cost position for AMOLEDs on glass.

Thin film imaging technology on glass and plastic

Hydrogenated amorphous silicon (a-Si:H) technology offers a viable technological alternative for improved imaging of optical signals and high energy radiation. This paper reviews X-ray imaging technology in terms of detector operating principles, including optoelectronic characteristics, and fabrication process issues related to pixel (Schottky diode detector plus thin film transistor) integration. Recent results which describe the extension of the current fabrication processes to low (/spl sim/120/spl deg/C) temperature are also presented. The low temperature processing enables fabrication of thin electronics on flexible (polymer) substrates.

A 3-TFT current-programmed pixel circuit for AMOLEDs

Current programmed circuits have demonstrated threshold voltage V/sub TH/ shift compensation to provide a stable drive current to the organic light-emitting diode (OLED). However, the degree of stability of drive current depends critically on the dynamic behavior of the circuit. This paper examines the dynamic behavior of a 3-TFT current programmed pixel and analyzes the impact of V/sub TH/ shift on the OLED drive current. The pixel circuit was implemented in amorphous silicon technology and lifetime tests show a 11% current degradation at 700 h.

Top-gate TFTs using 13.56 MHz PECVD microcrystalline silicon

Top-gate thin-film transistors (TFTs) with microcrystalline silicon (/spl mu/c-Si) channel layers deposited using standard 13.56 MHz plasma-enhanced chemical vapor deposition were fabricated at a maximum processing temperature of 250/spl deg/C. The TFTs employ amorphous silicon nitride (a-SiN) as the gate dielectric layer. The 80-nm-thick /spl mu/c-Si channel layer showed a dark conductivity of the order of 10/sup -7/ S/cm and a crystalline volume fraction of over 80%. The /spl mu/c-Si TFTs showed a field effect mobility of 0.85 cm/sup 2//V/spl middot/s, a threshold voltage of 4.8 V, a subthreshold slope of 1 V/dec, and an ON/OFF current ratio of /spl sim/10/sup 7/. More importantly, the TFTs were very stable under gate bias stress, offering promise for organic light-emitting display (OLED) applications.