Derek B. Workman

Electronic assembly including multiple substrates

Devices with microjetted polymer standoffs

No-flow underfill material and underfill method for flip chip devices

No-flow underfill process and material therefor

Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from

Curable composition having low coefficient of thermal expansion, method of making an integrated circuit, and an integrated circuit made there from

Silica nanoparticles thermoset resin compositions

Hyperbranched polymer and cycloaliphatic epoxy resin thermosets

Enhancement of underfill physical properties by the addition of a thermotropic cellulose

Radiopaque polymers for circuit board assembly