Dianzhong Wen

Fabrication and Characteristics of an nc-Si/c-Si Heterojunction MOSFETs Pressure Sensor

A novel nc-Si/c-Si heterojunction MOSFETs pressure sensor is proposed in this paper, with four p-MOSFETs with nc-Si/c-Si heterojunction as source and drain. The four p-MOSFETs are designed and fabricated on a square silicon membrane by CMOS process and MEMS technology where channel resistances of the four nc-Si/c-Si heterojunction MOSFETs form a Wheatstone bridge. When the additional pressure is P, the nc-Si/c-Si heterojunction MOSFETs pressure sensor can measure this additional pressure P. The experimental results show that when the supply voltage is 3 V, length-width (L:W) ratio is 2:1, and the silicon membrane thickness is 75 μm, the full scale output voltage of the pressure sensor is 15.50 mV at room temperature, and pressure sensitivity is 0.097 mV/kPa. When the supply voltage and L:W ratio are the same as the above, and the silicon membrane thickness is 45 μm, the full scale output voltage is 43.05 mV, and pressure sensitivity is 2.153 mV/kPa. Therefore, the sensor has higher sensitivity and good temperature characteristics compared to the traditional piezoresistive pressure sensor.

Characteristics of 2D magnetic field sensor based on magnetic sensitivity diodes

A two-dimensional (2D) magnetic field sensor is proposed in this paper. It contains two Wheatstone bridges composed of four magnetic sensitivity diodes(MSDs)with similar characteristics and four loading resistances. In order to realize the axial symmetric distribution of four MSDs, two MSDs with opposite magnetic sensitive directions were located along the x and −x axes, and two with opposite magnetic sensitive directions were located along the y and −y axes. The experimental results indicate that when VDD = 5.0 V, the magnetic sensitivities of the 2D magnetic sensor can reach SxB  =  544 mV/T and SyB  =  498 mV/T in the x and y directions, respectively. Consequently, it is possible to measure the two-dimensional magnetic field.

Two-Dimensional Magnetic Field Sensor Based on Silicon Magnetic Sensitive Transistors with Differential Structure

A two-dimensional (2D) magnetic field sensor consisting of four silicon magnetic sensitive transistors (SMSTs) with similar characteristics is presented in this paper. By use of micro-electromechanical systems (MEMS) and integrated packaging technology, this sensor fabricated by using the silicon wafer with a <100> orientation and high resistivity, was packaged on printed circuit boards (PCBs). In order to detect the magnetic fields in the x and y axes directions, two of the four SMSTs with opposite magnetic sensitive directions were located along the x and −x axes directions, symmetrically, and the others were located along the y and −y axes directions. The experimental results show that when the VCE = 10.0 V and IB = 6.0 mA, the magnetic sensitivities of the sensor in the x and y axes directions are 366.0 mV/T and 365.0 mV/T, respectively. It is possible to measure the 2D magnetic field and improve the magnetic sensitivity, significantly.

Design, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistors

Based on the nano-polysilicon thin film transistors (TFTs), a high-sensitivity pressure sensor was designed and fabricated in this paper. The pressure sensing element is composed of a Wheatstone bridge with four nano-polysilicon TFTs designed on different positions of the square silicon diaphragm. Via taking the four channel resistors of the TFTs as piezoresistors, the measurement to the external pressure can be realized according to the piezoresistive effects of channel layer. Through adopting complementary metal oxide semiconductor (CMOS) technology and micro-electromechanical system (MEMS) technology, the chips of sensor were fabricated on orientation silicon wafer with a high resistivity. At room temperature, when applying a voltage 5.0 V to the Wheatstone bridge, the full scale (100 kPa) output voltage and the sensitivity of the sensor with 35 μm-thick silicon diaphragm are 267 mV and 2.58 mV/kPa, respectively. The experimental results show that the pressure sensors can achieve a much higher s...

Temperature characteristics research of SOI pressure sensor based on asymmetric base region transistor

Based on the asymmetric base region transistor, a pressure sensor with temperature compensation circuit is proposed in this paper. The pressure sensitive structure of the proposed sensor is constructed by a C-type silicon cup and a Wheatstone bridge with four piezoresistors ( R 1 , R 2 , R 3 and R 4 ) locating on the edge of a square silicon membrane. The chip was designed and fabricated on a silicon on insulator (SOI) wafer by micro electromechanical system (MEMS) technology and bipolar transistor process. When the supply voltage is 5.0 V, the corresponding temperature coefficient of the sensitivity (TCS) for the sensor before and after temperature compensation are -1862 and -1067 ppm/℃, respectively. Through varying the ratio of the base region resistances r 1 and r 2 , the TCS for the sensor with the compensation circuit is -127 ppm/℃. It is possible to use this compensation circuit to improve the temperature characteristics of the pressure sensor.

Fabrication Technology and Characteristics Research of a Monolithically-Integrated 2D Magnetic Field Sensor Based on Silicon Magnetic Sensitive Transistors

A monolithically-integrated two-dimensional (2D) magnetic field sensor consisting of two difference structures (DSІ and DSII) is proposed in this paper. The DSІ and DSII are composed of four silicon magnetic sensitive transistors (SMST1, SMST2, SMST3 and SMST4) and four collector load resistors (RL1, RL2, RL3 and RL4). Based on the magnetic sensitive principle of SMST, the integrated difference structure can detect magnetic fields’ component (Bx and By) along the x-axis and y-axis, respectively. By adopting micro-electromechanical systems (MEMS) and packaging technology, the chips were fabricated on a p-type <100> orientation silicon wafer with high resistivity and were packaged on printed circuit boards (PCBs). At room temperature, when the VCE = 5.0 V and IB = 8.0 mA, the magnetic sensitivities (Sxx and Syy) along the x-axis and the y-axis were 223 mV/T and 218 mV/T, respectively. The results show that the proposed sensor can not only detect the 2D magnetic field vector (B) in the xy plane, but also that Sxx and Syy exhibit good uniformity.

Fabrication Technology and Characteristics Research of the Acceleration Sensor Based on Li-Doped ZnO Piezoelectric Thin Films

An acceleration sensor based on piezoelectric thin films is proposed in this paper, which comprises the elastic element of a silicon cantilever beam and a piezoelectric structure with Li-doped ZnO piezoelectric thin films. The Li-doped ZnO piezoelectric thin films were prepared on SiO2/Si by radio frequency (RF) magnetron sputtering method. The microstructure and micrograph of ZnO piezoelectric thin films is analysed by a X-ray diffractometer (XRD), scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS), and piezoresponse force microscopy (PFM), respectively. When the sputtering power of 220 W and Li-doped concentration of 5%, ZnO piezoelectric thin films have a preferred (002) orientation. The chips of the sensor were fabricated on the <100> silicon substrate by micro-electromechanical systems (MEMS) technology, meanwhile, the proposed sensor was packaged on the printed circuit board (PCB). The experimental results show the sensitivity of the proposed sensor is 29.48 mV/g at resonant frequency (1479.8 Hz).

Characteristics research of pressure sensor based on nanopolysilicon thin films resistors

To further improve the sensitivity temperature characteristics of pressure sensor, a kind of pressure sensor taking nanopolysilicon thin films as piezoresistors is proposed in this paper. On the basis of the microstructure analysis by X-ray diffraction (XRD) and scanning electron microscope (SEM) tests, the preparing process of nanopolysilicon thin films is optimized. The effects of film thickness and annealing temperature on the micro-structure of nanopolysilicon thin films were studied, respectively. In order to realize the measurement of external pressure, four nanopolysilicon thin films resistors were arranged at the edges of square silicon diaphragm connected to a Wheatstone bridge, and the chip of the sensor was designed and fabricated on a 〈100〉 orientation silicon wafer by microelectromechanical system (MEMS) technology. Experimental result shows that when I = 6.80 mA, the sensitivity of the sensor PS-1 is 0.308 mV/kPa, and the temperature coefficient of sensitivity (TCS) is about −1742 ppm/∘C in the range of −40–140∘C. It is possible to obviously improve the sensitivity temperature characteristics of pressure sensor by the proposed sensors.