Digbijoy N. Nath

p-type doping of MoS2 thin films using Nb

We report on the first demonstration of p-type doping in large area few-layer films of (0001)-oriented chemical vapor deposited MoS2. Niobium was found to act as an efficient acceptor up to relatively high density in MoS2 films. For a hole density of 3.1 × 1020 cm−3, Hall mobility of 8.5 cm2 V−1 s−1 was determined, which matches well with the theoretically expected values. X-ray diffraction scans and Raman characterization indicated that the film had good out-of-plane crystalline quality. Absorption measurements showed that the doped sample had similar characteristics to high-quality undoped samples, with a clear absorption edge at 1.8 eV. Scanning transmission electron microscope imaging showed ordered crystalline nature of the Nb-doped MoS2 layers stacked in the [0001] direction. This demonstration of substitutional p-doping in large area epitaxial MoS2 could help in realizing a wide variety of electrical and opto-electronic devices based on layered metal dichalcogenides.

Large area single crystal (0001) oriented MoS2

Layered metal dichalcogenide materials are a family of semiconductors with a wide range of energy band gaps and properties, the potential for exciting physics and technology applications. However, obtaining high crystal quality thin films over a large area remains a challenge. Here we show that chemical vapor deposition (CVD) can be used to achieve large area single crystal Molybdenum Disulfide (MoS2) thin films. Growth temperature and choice of substrate were found to critically impact the quality of film grown, and high temperature growth on (0001) oriented sapphire yielded highly oriented single crystal MoS2 films. Films grown under optimal conditions were found to be of high structural quality from high-resolution X-ray diffraction, transmission electron microscopy, and Raman measurements, approaching the quality of reference geological MoS2. Photoluminescence and electrical measurements confirmed the growth of optically active MoS2 with a low background carrier concentration, and high mobility. The CVD method reported here for the growth of high quality MoS2 thin films paves the way towards growth of a variety of layered 2D chalcogenide semiconductors and their heterostructures.

Electrical properties of atomic layer deposited aluminum oxide on gallium nitride

We report on our investigation of the electrical properties of metal/Al2O3/GaN metal-insulator-semiconductor capacitors. We determined the conduction band offset and interface charge density of the alumina/GaN interface by analyzing the capacitance-voltage characteristics of atomic layer deposited Al2O3 films on GaN substrates. The conduction band offset at the Al2O3/GaN interface was calculated to be 2.13 eV, in agreement with theoretical predications. A non-zero field of 0.93 MV/cm in the oxide under flat-band conditions in the GaN was inferred, which we attribute to a fixed net positive charge density of magnitude 4.60 × 1012 cm−2 at the Al2O3/GaN interface. We provide hypotheses to explain the origin of this charge by analyzing the energy band line-up.

Suppression of electron overflow and efficiency droop in N-polar GaN green light emitting diodes

In this letter, we experimentally demonstrate direct correlation between efficiency droop and carrier overflow in InGaN/GaN green light emitting diodes (LEDs). Further, we demonstrate flat external quantum efficiency curve up to 400 A/cm2 in a plasma assisted molecular beam epitaxy grown N-polar double quantum well LED without electron blocking layers. This is achieved by exploring the superior properties of reverse polarization field of N-face polarity, such as effective carrier injection and higher potential barriers against carrier overflow mechanism. The LEDs were found to operate with a low (∼2.3 V) turn-on voltage.

Polarization-engineered GaN/InGaN/GaN tunnel diodes

We report on the design and demonstration of polarization-engineered GaN/InGaN/GaN tunnel junction diodes with high current density and low tunneling turn-on voltage. Wentzel–Kramers–Brillouin calculations were used to model and design tunnel junctions with narrow band gap InGaN-based barrier layers. N-polar p-GaN/In0.33Ga0.67N/n-GaN heterostructure tunnel diodes were grown using molecular beam epitaxy. Efficient interband tunneling was achieved close to zero bias with a high current density of 118 A/cm2 at a reverse bias of 1 V, reaching a maximum current density up to 9.2 kA/cm2. These results represent the highest current density reported in III-nitride tunnel junctions and demonstrate the potential of III-nitride tunnel devices for a broad range of optoelectronic and electronic applications.

Molecular beam epitaxy of N-polar InGaN

We report on the growth of N-polar InxGa1−xN by N2 plasma-assisted molecular beam epitaxy. Ga-polar and N-polar InGaN films were grown at different growth temperatures and the composition was estimated by photoluminescence (PL) measurements. A growth model that incorporates the incoming and desorbing atomic fluxes is proposed to explain the compositional dependence of InGaN on the flux of incoming atomic species and growth temperature. The growth model is found to be in agreement with the experimental data. The peak PL intensity for N-face samples is found to exhibit a two order of magnitude increase for a 100 °C increase in growth temperature. Besides, at 600 nm, the N-face sample shows more than 100 times higher PL intensity than Ga-face sample at comparable wavelengths indicating its superior optical quality. The understanding of growth kinetics of InGaN presented here will guide the growth of N-polar InGaN in a wide range of growth temperatures.

Interface charge engineering at atomic layer deposited dielectric/III-nitride interfaces

Interface charges at atomic layer deposited Al2O3/III-nitride interfaces were investigated for III-nitride layers of different polarity. A large positive sheet charge density is induced at the Al2O3/III-nitride interface on all the orientations of GaN and Ga-polar AlGaN, and this sheet charge can be significantly altered using post-metallization anneals. It is proposed that the charges are caused by interfacial defects that can be passivated and neutralized through a H2 based anneal. Tailoring of the interface charge density described here can be used to improve critical device characteristics such as gate leakage and electron transport, and for lateral electrostatic engineering.

Interface Charge Engineering for Enhancement-Mode GaN MISHEMTs

We demonstrate an efficient approach to engineer the dielectric/AlGaN positive interface fixed charges by oxygen plasma and post-metallization anneal. Significant suppression of interface fixed charges from 2 × 1013 to 8 × 1012 cm-2 was observed. Experimental and theoretical electron mobility characteristics and the impact of remote impurity scattering were investigated. The reduction in oxide/semiconductor interface charge density leads to an increase of electron mobility, and enables a positive threshold voltage.

Unipolar vertical transport in GaN/AlGaN/GaN heterostructures

In this letter, we report on unipolar vertical transport characteristics in c-plane GaN/AlGaN/GaN heterostructures. Vertical current in heterostructures with random alloy barriers was found to be independent of dislocation density and heterostructure barrier height. Percolation-based transport due to random alloy fluctuations in the ternary AlGaN is suggested as the dominant transport mechanism. This hypothesis is supported by simulations using drift-diffusion transport model incorporating statistical fluctuations of Al-composition and confirmed through experiments showing that non-random or digital AlGaN alloys and polarization-engineered binary GaN barriers can eliminate percolation transport and reduce leakage significantly. The understanding of vertical transport and methods for effective control proposed here will greatly impact III-nitride unipolar vertical devices.

Growth model for plasma-assisted molecular beam epitaxy of N-polar and Ga-polar InxGa1−xN

The authors have developed a comprehensive model for the growth of N-polar and Ga-polar InxGa1−xN by N2 plasma-assisted molecular beam epitaxy. GaN films of both polarities were coloaded and InxGa1−xN was grown in the composition range of 0.14<x<0.59 at different growth temperatures keeping all other conditions identical. The compositions were estimated by triple-axis ω-2θ x-ray diffraction scans as well as by room temperature photoluminescence measurements. The dependence of the In composition x in InxGa1−xN on growth temperature and the flux of incoming atomic species is explained using a comprehensive growth model which incorporates desorption of atomic fluxes as well as decomposition of InN component of InxGa1−xN. The model was found to be in good agreement with the experimental data for InxGa1−xN of both polarities. A N-polar In0.31Ga0.69N/In0.05Ga0.95N multi-quantum-well structure grown with conditions predicted by our growth model was found to match the compositions of the active layers well beside...