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Dino F. DiFranco

Gould Electronics

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Archive | 1993

Electrodeposited copper foil and process for making same

Dino F. DiFranco; Shiuh-Kao Chiang; Craig J Hasegawa

Archive | 1991

Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations

Sidney J. Clouser; Dino F. DiFranco; Craig J Hasegawa

Archive | 1990

Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same

Dino F. DiFranco; Sidney J. Clouser

Archive | 1994

Electrodeposited copper foil

Sidney J. Clouser; Dino F. DiFranco; Craig J Hasegawa

Archive | 1990

Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same

Dino F. DiFranco; Sidney J. Clouser

Archive | 1993

Anti-oxidant coatings for copper foils

Dino F. DiFranco

Archive | 1994

Electroplated copper foil, and processes for their preparation

Dino F. DiFranco; Shiuh-Kao Chiang; Craig J Hasegawa

Archive | 1994

Elektroplattierte Kupferfolie und Verfahren zu deren Herstellung Electroplated copper foil, and processes for their preparation

Dino F. DiFranco; Shiuh-Kao Chiang; Craig J Hasegawa

Archive | 1994

Electrodeposited copper foil and its production

Shiuh-Kao Chiang; Dino F. DiFranco; Craig J Hasegawa; ジェイ． ハセガワ クレイグ; チャン シウ−カオ; エフ． ディフランコ ディノ

Archive | 1991

ELEKTROPLATTIERTE KUPFERFOLIE UND DEREN HERSTELLUNG UNTER VERWENDUNG ELEKTROLYTISCHER LöSUNGEN MIT NIEDRIGEN KONZENTRATIONEN VON CHLOR IONEN COPPER FOIL electroplated AND THEIR PRODUCTION USING ELECTROLYTIC SOLUTIONS WITH LOW CONCENTRATIONS OF CHLORINE IONS

Sidney J. Clouser; Dino F. DiFranco; Craig J Hasegawa

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Craig J Hasegawa

Gould Electronics

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Sidney J. Clouser

Gould Electronics

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Shiuh-Kao Chiang

Gould Electronics

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