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Featured researches published by Doi Hiroaki.


Computers & Structures | 1987

Thermo-elastic analysis of thin film multilayer structure with a crack

Doi Hiroaki; Sakata Shinji; Sakamoto Tatsuji; Shimizu Tasuku

Abstract A post-processor which calculates the J - integral from the results of ADINA is developed and applied to cracks in thin film multilayer circuit boards for large-size computers. The relation between the J - integral and the material properties (Youngs modulus and the thermal expansion coefficient) of the conductor and the insulator of the circuit board is investigated.


Archive | 1981

Laminates comprising prepregs metal clad

Yasuo Miyadera; Atsushi Fujioka; Tetsuo Kumazawa; Doi Hiroaki


Archive | 1982

Metal having low melting point

Yamada Toshihiro; Nishimura Asao; Satou Motohiro; Doi Hiroaki; Sakamoto Tatsuji; Ooguro Takahiro; Kobayashi Fumiyuki


Archive | 2004

COOLING SYSTEM AND COOLING CONTROL METHOD OF MOTORIZED DEVICE

Sasaki Kaname; Doi Hiroaki; Hamada Haruki; Hayashi Masaaki; Saito Ryuichi


Archive | 1984

VERKAPSELTE INTEGRIERTE SCHALTUNG

Ogihara Satoru; Kodama Hironori; Sonobe Kastuhiro; Doi Hiroaki; Kobayashi Fumiyuki


Archive | 1983

THERMAL CONDUCTION CONNECTING DEVICE

Yamada Toshihiro; Shida Shigeru; Ooguro Takahiro; Satou Motohiro; Nishimura Asao; Doi Hiroaki; Sakamoto Tatsuji; Ashiwake Noriyuki; Kobayashi Fumiyuki


Archive | 1993

FATIGUE TESTING MACHINE FOR FINE TESTING PIECE

Doi Hiroaki; Kouno Masaya; Minamitani Rintaro; Hatsuda Toshio


Archive | 1987

MEASURING METHOD FOR ELASTIC COEFFICIENT

Doi Hiroaki; Sakamoto Tatsuji; Otsuka Kanji


Archive | 1987

PACKAGED INTEGRATED CIRCUIT DEVICE

Ogihara Satoru; Kodama Hironori; Sonobe Kastuhiro; Doi Hiroaki; Kobayashi Fumiyuki


Archive | 1985

JUNCTION STRUCTURE OF SILICON CARBIDE AND LOW-MELTING POINT GLASS

Doi Hiroaki; Sakamoto Tatsuji; Yamada Toshihiro; Satou Motohiro; Ootsuka Kanji

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