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Dive into the research topics where Dominique Vicard is active.

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Featured researches published by Dominique Vicard.


international conference on rfid | 2010

UHF RFID transponder with miniaturized packaging and interconnection

Laurent Dussopt; Jean Brun; Dominique Vicard; François Frassati; Benoît Lepine

This paper presents the design and demonstration of UHF RFID tags based on commercial chips with wafer-level packaging and direct die-to-wire interconnection. The packaging and connection technology is presented and shown to have the potential to be a low-cost industrial process. The performances of the processed dies are characterized and compared to a standard wirebonding technology, showing no significant difference. Finally, several tags are demonstrated and exhibit read range performances in good agreement with the theory.


european microelectronics and packaging conference | 2009

Packaging and wired interconnections for insertion of miniaturized chips in smart fabrics

Jean Brun; Dominique Vicard; Bruno Mourey; Benoît Lepine; François Frassati


Archive | 2007

Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure

Dominique Vicard; Bruno Mourey; Jean Brun


Archive | 2009

Method and device for manufacturing an assembly with at least two microelectronic chips

Jean Brun; Benoît Lepine; Bruno Mourey; Dominique Vicard


Archive | 2008

Method for producing a set of chips mechanically interconnected by means of a flexible connection

Jean Brun; Bruno Mourey; Dominique Vicard


Archive | 2013

ELECTROSTATIC DEVICE AND METHOD FOR RECOVERING MECHANICAL ENERGY BY TRIBOELECTRIC EFFECT

Ghislain Despesse; Sebastien Boisseau; Dominique Vicard


Archive | 2008

Assembly including a wire member and a microelectronic chip with a notch, including at least one stud for holding the wire member

Jean Brun; Dominique Vicard; Sophie Verrun


Archive | 2009

Assemblage d'une puce microélectronique à rainure avec un élément filaire sous forme de toron et procédé d'assemblage

Jean Brun; Sophie Verrun; Dominique Vicard


Archive | 2009

Method and device for fabricating an assembly of at least two microelectronic chips

Jean Brun; Benoît Lepine; Bruno Mourey; Dominique Vicard


Archive | 2008

Assembly of radiofrequency chips

Dominique Vicard; Jean Brun; Benoît Lepine

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Loic Marnat

University of Grenoble

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