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Dive into the research topics where Donald William Kidwell is active.

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Featured researches published by Donald William Kidwell.


international conference on solid state sensors actuators and microsystems | 2017

High fill factor piezoelectric micromachined ultrasonic transducers on transparent substrates

Guo-Lun Luo; Stephanie Fung; Qi Wang; Yuri Kusano; Jon Bradley Lasiter; Donald William Kidwell; David A. Horsley

This study presents a high fill-factor array of aluminum nitride (AlN) piezoelectric micromachined ultrasonic transducers (PMUTs) fabricated on a transparent substrate. PMUTs with diameters ranging from 40 microns to 100 microns were fabricated, resulting in resonant frequencies from 3 MHz to 18 MHz in air. A high fill factor of 62% was achieved. Immersed pulse-echo experiments were conducted at 2.5 MHz.


Archive | 2012

PASSIVES VIA BAR

Ravindra V. Shenoy; Kwan-Yu Lai; Jon Bradley Lasiter; Jonghae Kim; Mario Francisco Velez; Chi Shun Lo; Donald William Kidwell; Philip Jason Stephanou; Justin Phelps Black; Evgeni Petrovich Gousev


Archive | 2014

THROUGH SUBSTRATE VIA INDUCTORS

Ravindra V. Shenoy; Jitae Kim; Kwan-Yu Lai; Jon Bradley Lasiter; Philip Jason Stephanou; Donald William Kidwell; Evgeni Petrovich Gousev


Archive | 2013

SEMICONDUCTOR DEVICE WITH VIA BAR

Ravindra V. Shenoy; Kwan-Yu Lai; Jon Bradley Lasiter; Philip Jason Stephanou; Donald William Kidwell; Evgeni Petrovich Gousev


Archive | 2014

Metal-insulator-metal capacitors on glass substrates

Jon Bradley Lasiter; Ravindra V. Shenoy; Donald William Kidwell; Victor Louis Arockiaraj Pushparaj; Kwan-Yu Lai; Ana Rangelova Londergan


Archive | 2012

Adhesive metal nitride on glass and related methods

Victor Louis Arockiaraj Pushparaj; Ravindra V. Shenoy; Jon Bradley Lasiter; Kwan-Yu Lai; Donald William Kidwell; Ana Rangelova Londergan


Archive | 2013

HIGH CAPACITANCE DENSITY METAL-INSULATOR-METAL CAPACITORS

Jon Bradley Lasiter; Ravindra V. Shenoy; Justin Phelps Black; Donald William Kidwell


Archive | 2015

ELECTRO-OPTICAL TRANSCEIVER DEVICE TO ENABLE CHIP-TO-CHIP INTERCONNECTION

Kwan-Yu Lai; Ravindra V. Shenoy; Jitae Kim; Jon Bradley Lasiter; Donald William Kidwell; Evgeni Petrovich Gousev


Archive | 2013

An inductor provided by vias through a substrate

Ravindra V. Shenoy; Jitae Kim; Kwan-Yu Lai; Jon Bradley Lasiter; Philip J. Stephanou; Donald William Kidwell; Evgeni Petrovich Gousev


Archive | 2016

Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate

Donald William Kidwell; Ravindra V. Shenoy; Mete Erturk; Layal Rouhana

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