Dongguo Lin

Development of Powder Injection Molding Process for a Piezoelectric PAN-PZT Ceramics

A powder injection molding process is developed and optimized for piezoelectric PAN-PZT ceramics. Torque rheometer experiments are conducted to determine the optimal solids loading, and the rheological property of the feedstock is evaluated using a capillary rheometer. Appropriate debinding conditions are chosen using a thermal gravity analyzer, and the debound specimens are sintered using sintering conditions determined in a preliminary investigation. Piezoelectric performance measures, including the piezoelectric charge constant and dielectric constant, are measured to verify the developed process. The average values of the measured piezoelectric charge constant and dielectric constant are 455 pC/N and 1904, respectively. Powder injection molded piezoelectric ceramics produced by the optimized process show adequate piezoelectric performance compared to press-sintered piezoelectric ceramics.

Development of Powder Injection Molding Process for Fabrication of Glass Component

Powder injection molding (PIM), which combines the advantages of powder metallurgy and plastic injection molding technologies, has become one of the most efficient methods for the net-shape production of both metal and ceramic components. In this work, plasma display panel glass bodies are prepared by the PIM process. After sintering, the hot isostatic pressing (HIP) process is adopted for improving the density and mechanical properties of the PIMed glass bodies. The mechanical and thermal behaviors of the prepared specimens are analyzed through bending tests and dilatometric analysis, respectively. After HIPing, the flexural strength of the prepared glass body reaches up to 92.17 MPa, which is 1.273 and 2.178 times that of the fused glass body and PIMed bodies, respectively. Moreover, a thermal expansion coefficient of is obtained, which coincides with that of the raw glass powder (), indicating that the glass body is fully densified after the HIP process.