Dongkai Shangguan
Ford Motor Company
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Publication
Featured researches published by Dongkai Shangguan.
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B | 1994
Dongkai Shangguan; Achyuta Achari; Wells L. Green
As part of the lead-free solder development process currently underway, this paper presents the evaluation of the lead-free Sn-Ag solder for use in no-clean thick film electronics packages. The Sn-Ag (96.5/3.5 wt%) eutectic solder alloy, with a no clean flux system, is the focus of this study. Based on studies of metallurgical interactions, the conductor/substrate adhesion, and electromigration/dendritic growth, it is concluded that this solder has superior overall properties and is suitable for solder interconnects in thick film automotive electronics packages when used with a mixed bonded Ag conductor. >
Archive | 1996
Achyuta Achari; Mohan R. Paruchuri; Dongkai Shangguan
Archive | 1997
Mohan R. Paruchuri; Dongkai Shangguan
Archive | 1997
Mohan R. Paruchuri; Dongkai Shangguan
Archive | 1998
Dongkai Shangguan; Myron Lemecha; Achyuta Achari
Archive | 1996
Mohan R. Paruchuri; Dongkai Shangguan
Archive | 1999
Dongkai Shangguan; Mohan R. Paruchuri; Achyuta Achari
Archive | 1994
Dongkai Shangguan; Achyuta Achari
Archive | 1997
Mohan R. Paruchuri; Dongkai Shangguan
Archive | 1997
Mohan R. Paruchuri; Dongkai Shangguan
