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Dustin A. Woodbury

Harris Corporation

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Archive | 1999

Semiconductor device with doped semiconductor and dielectric trench sidewall layers

Dustin A. Woodbury

Archive | 1996

Process of forming trench isolation device

Patrick A. Begley; Donald F. Hemmenway; George Bajor; Anthony L. Rivoli; Jeanne M. McNamara; Michael Sean Carmody; Dustin A. Woodbury

Archive | 1996

P-collector H.V. PMOS switch VT adjusted source/drain

Dustin A. Woodbury; James D. Beasom; James W. Swonger

Archive | 2001

Wafer trench article and process

Patrick A. Begley; Donald F. Hemmenway; George Bajor; Anthony L. Rivoli; Jeanne M. McNamara; Michael Sean Carmody; Dustin A. Woodbury

Archive | 2005

Integrated circuit having a device wafer with a diffused doped backside layer

Joseph A. Czagas; Dustin A. Woodbury; James D. Beasom

Archive | 2002

Highly linear integrated resistive contact

Dustin A. Woodbury; Joseph A. Czagas

Archive | 2000

Method for making a diffused back-side layer on a bonded-wafer with a thick bond oxide

Joseph A. Czagas; Dustin A. Woodbury; James D. Beasom

Archive | 2010

Integrated process for thin film resistors with silicides

John T. Gasner; John Stanton; Dustin A. Woodbury; James D. Beasom

Archive | 1999

Method of forming resistive contacts on intergrated circuits with mobility spoiling ions including high resistive contacts and low resistivity silicide contacts

Dustin A. Woodbury; Joseph A. Czagas

Archive | 1997

Contact regions for narrow trenches in semiconductor devices and method

James D. Beasom; Dustin A. Woodbury

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