Earl T. Cohen
Cisco Systems, Inc.
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Publication
Featured researches published by Earl T. Cohen.
IEEE Journal of Solid-state Circuits | 1997
Cliff A. Maier; James A. Markevitch; Cheryl Senter Brashears; Tim Sippel; Earl T. Cohen; Jim Blomgren; James G. Ballard; Jay C. Pattin; Viki Moldenhauer; Jeffrey A. Thomas; George Taylor
This 533-MHz BiCMOS very large scale integration (VLSI) implementation of the PowerPC architecture contains three pipelines and a large on-chip secondary cache to achieve a peak performance of 1600 MIPS. The 15 mm/spl times/10 mm die contains 2.7 M transistors (2M CMOS and 0.7 M bipolar) and dissipates less than 85 W. The die is fabricated in a six-level metal, 0.5-/spl mu/m BiCMOS process and requires 3.6 and 2.1 V power supplies.
Archive | 1996
Earl T. Cohen; James S. Blomgren; David E. Richter
Archive | 1994
Earl T. Cohen; Russell W. Tilleman; Jay C. Pattin; James S. Blomgren
Archive | 1994
James S. Blomgren; Earl T. Cohen; Brian R. Baird
Archive | 2002
Srinivasa Rao Malladi; Earl T. Cohen
Archive | 1994
James S. Blomgren; Earl T. Cohen
Archive | 1994
David E. Richter; Earl T. Cohen; James S. Blomgren
Archive | 1996
Earl T. Cohen; Jay C. Pattin
Archive | 1996
Earl T. Cohen; Jay C. Pattin
Archive | 2004
Earl T. Cohen; Robert Olsen; Eugene M. Feinberg; Gregory L. Ries
