Edward A. Preble

Accurate dependence of gallium nitride thermal conductivity on dislocation density

The authors experimentally find that the thermal conductivity of gallium nitride depends critically on dislocation density using the 3-omega technique. For GaN with dislocation densities lower than 106cm−2, the thermal conductivity is independent with dislocation density. The thermal conductivity decreases with a logarithmic dependence for material with dislocation densities in the range of 107–1010cm−2. These results are in agreement with theoretical predictions. This study indicates that the hydride vapor phase epitaxy method offers an attractive route for the formation of semi-insulating gallium nitride with optimal thermal conductivity values around 230W∕mK and very low dislocation density near 5×104cm−2.

GaN ultraviolet avalanche photodiodes with optical gain greater than 1000 grown on GaN substrates by metal-organic chemical vapor deposition

We report the performance of GaN p-i-n ultraviolet avalanche photodiodes grown on bulk GaN substrates by metal-organic chemical vapor deposition. The low dislocation density in the devices enables low reverse-bias dark currents prior to avalanche breakdown for ∼30μm diameter mesa photodetectors. The photoresponse is relatively independent of the bias voltage prior to the onset of avalanche gain which occurs at an electric field of ∼2.8MV∕cm. The magnitude of the reverse-bias breakdown voltage shows a positive temperature coefficient of ∼0.05V∕K, confirming that the avalanche breakdown mechanism dominates. With ultraviolet illumination at λ∼360nm, devices with mesa diameters of ∼50μm achieve stable maximum optical gains greater than 1000. To the best of our knowledge, this is the highest optical gain achieved for GaN-based avalanche photodiodes and the largest area III-N avalance photodetectors yet reported.

Green light emitting diodes on a-plane GaN bulk substrates:

We report the development of 520–540nm green light emitting diodes (LEDs) grown along the nonpolar a axis of GaN. GaInN∕GaN-based quantum well structures were grown in homoepitaxy on both, a-plane bulk GaN and a-plane GaN on r-plane sapphire. LEDs on GaN show higher, virtually dislocation-free crystalline quality and three times higher light output power when compared to those on r-plane sapphire. Both structures show a much smaller wavelength blue shift for increasing current density (<10nm for 0.1to12.7A∕cm2) than conventional LEDs grown along the polar c axis.

High-quality bulk a-plane GaN sliced from boules in comparison to heteroepitaxially grown thick films on r-plane sapphire

Thick GaN bars with [1120] orientation have been sliced from GaN boules grown on freestanding films by hydride vapor phase epitaxy (HVPE) in the [0001] direction. High-resolution x-ray diffraction and transmission electron microscopy have been used to study the structural quality and defect distribution in the material in comparison to heteroepitaxially grown thick HVPE-GaN films grown in the [1120] direction on (1102)-plane sapphire. It is demonstrated that while the heteroepitaxial material possesses a high density of stacking faults and partial dislocations, leading to anisotropic structural characteristics, the (1120)-plane bulk GaN, sliced from boules, exhibits low dislocation density and narrow rocking curves with isotropic in-plane character.

Temperature-dependent electrical characteristics of bulk GaN Schottky rectifier

The temperature-dependent electrical characteristics of Schottky rectifiers fabricated with a SiO2 field plate on a freestanding n− gallium nitride (GaN) substrate were reported in the temperature range of 298–473K. The Schottky barrier heights evaluated from forward current-voltage measurement revealed an increase of Schottky barrier height and series resistance but a decrease of ideality factor (n) with increasing temperature. However, the Schottky barrier heights evaluated from capacitance-voltage measurement remained almost the same throughout the temperature range measured. The Richardson constant extrapolated from ln(J0∕T2) vs 1∕T plot was found to be 0.029Acm−2K−2. A modified Richardson plot with ln(J0∕T2) vs 1∕nT showed better linearity, and the corresponding effective Richardson constant was 35Acm−2K−2. The device showed a high reverse breakdown voltage of 560V at room temperature. The negative temperature coefficients were found for reverse breakdown voltage, which is indicative of a defect-assi...

Universal phonon mean free path spectra in crystalline semiconductors at high temperature

Thermal conductivity in non-metallic crystalline materials results from cumulative contributions of phonons that have a broad range of mean free paths. Here we use high frequency surface temperature modulation that generates non-diffusive phonon transport to probe the phonon mean free path spectra of GaAs, GaN, AlN, and 4H-SiC at temperatures near 80 K, 150 K, 300 K, and 400 K. We find that phonons with MFPs greater than 230 ± 120 nm, 1000 ± 200 nm, 2500 ± 800 nm, and 4200 ± 850 nm contribute 50% of the bulk thermal conductivity of GaAs, GaN, AlN, and 4H-SiC near room temperature. By non-dimensionalizing the data based on Umklapp scattering rates of phonons, we identified a universal phonon mean free path spectrum in small unit cell crystalline semiconductors at high temperature.

Wavelength-stable cyan and green light emitting diodes on nonpolar m-plane GaN bulk substrates

We report the development of 480 nm cyan and 520 nm green light emitting diodes (LEDs) with a highly stable emission wavelength. The shift is less than 3 nm when the drive current density is changed from 0.1 to 38 A/cm2. LEDs have been obtained in GaInN-based homoepitaxy on nonpolar m-plane GaN bulk substrates. For increasing emission wavelength we find a large number of additional dislocations generated within the quantum wells (2×108 to ∼1010 cm2) and a decrease in the electroluminescence efficiency. This suggests that the strain induced generation of defects plays a significant role in the performance limitations.

Gallium nitride materials - progress, status, and potential roadblocks

Metal-organic vapor phase epitaxy (MOVPE) and molecular beam epitaxy (MBE) are the principal techniques for the growth and n-type (Si) and p-type (Mg) doping of III-nitride thin films on sapphire and silicon carbide substrates as well as previously grown GaN films. Lateral and pendeoepitaxy via MOVPE reduce significantly the dislocation density and residual strain in GaN and AlGaN films. However tilt and coalescence boundaries are produced in the laterally growing material. Very high electron mobilities in the nitrides have been realized in radio-frequency plasma-assisted MBE GaN films and in two-dimensional electron gases in the AlGaN/GaN system grown on MOVPE-derived GaN substrates at the crossover from the intermediate growth regime to the droplet regime. State-of-the-art Mg doping profiles and transport properties have been achieved in MBE-derived p-type GaN. The Mg-memory effect, and heterogeneous growth, substrate uniformity, and flux control are significant challenges for MOVPE and MBE, respectively. Photoluminescence (PL) of MOVPE-derived unintentionally doped (UID) heteroepitaxial GaN films show sharp lines near 3.478 eV due to recombination processes associated with the annihilation of free-excitons (FEs) and excitons bound to a neutral shallow donor (D/spl deg/X).

Strain and crystallographic tilt in uncoalesced GaN layers grown by maskless pendeoepitaxy

The strain in thin GaN layers grown by maskless pendeoepitaxy has been investigated using high-resolution x-ray diffraction and finite-element simulations. The crystallographic tilt of the free-hanging wings was determined to result from the strain relaxation of the seed stripes along [0001]. The impact of the dimensions of the pendeostructure and of the formation of crystal defects on the expected wing tilt is discussed.

Ultra-low leakage and high breakdown Schottky diodes fabricated on free-standing GaN substrate

Vertical Schottky diodes were fabricated on the bulk GaN substrate with decreasing impurity concentration from N-face to Ga-face. An array of circular Pt Schottky contacts and a full backside Ti/Al/Ni/Au ohmic contact were prepared on the Ga-face and the N-face of the n-GaN substrate, respectively. The Schottky diode exhibits a minimum specific on-state