Edward V. Weber

Shaped Beams For Integrated Circuit Fabrication

Numerous types of electron-beam lithography systems have been designed and built over the years. The variable shaped probe with vector deflection type has emerged as the most common of the recent designs. This architectures popularity stems primarily from the superior writing speed for any given resolution and dose requirement by virtue of the ability to expose numerous pattern elements in parallel while at the same time retaining the flexibility of digital pattern description. High currents for rapid registration mark acquisition and relatively low circuit speed requirements are also advantages of the variable shaped spot vector deflection design.

Electron Beam Systems At IBM Status Report

For over ten years IBM has been pursuing Manufacturing Electron Beam Systems in Manufacturing for direct wafer lithography exposure. These efforts have resulted in three generations of systems for wafer exposure, each with a greater capability. These systems have been configured to minimize system ailments and to maximize throughput. Their principal application has been to reduce turn around time. They have provided satisfactory service in Manufacturing and in Development applications. Having proved themselves to be beneficial and reliable Manufacturing tools, electron beams are being implemented for additional applications. Mask exposure, mask inspection and module inspection are some of the newer applications for E-Beam systems, in IBM at East Fishkill.