Eishi Gofuku
Mitsubishi Electric
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Publication
Featured researches published by Eishi Gofuku.
SID Symposium Digest of Technical Papers | 2002
Hiroaki Sugiura; Shuichi Kagawa; Hideyuki Kaneko; Eishi Gofuku
The authors have developed a LCD module that adopts a color conversion circuit which can contribute to the improvement of imperfect color reproduction in the LCD panel. The new module adopts a color conversion circuit that uses a new matrix calculation which we have developed. This color conversion circuit allows support of motion picture display and real time processing. In addition, it enables realization of desired color conversion characteristics and it also facilitates realization of use of two or more types of color conversion characteristics by selection.
Applied Surface Science | 1991
Eishi Gofuku; Yoshihiko Toyoda; Y. Uehara; M. Kohara; Masahiro Nunoshita
Abstract Changes in TiO 2 thin films caused by electron-beam (EB) bombardment have been investigated by measuring their structural, electrical and optical properties. The TiO 2 films of 500 nm thickness were deposited on fused silica substrates by the EB-evaporation technique. These as-deposited films are in a highly insulating amorphous state (more than 10 11 Ω m). By using an EB of 10 kV and 30 mA, the as-deposited film is modified to be in a crystalline (anatase) state with a low resistivity of less than 5 × 10 −4 Ω m.
SID Symposium Digest of Technical Papers | 2002
Jun Someya; Masaki Yamakawa; Noritaka Okuda; Tomohiro Kimura; Masayuki Yoshida; Eishi Gofuku
The algorithm to reduce the memory capacity in FFD (Feedforward Driving) is discussed. FFD improves the motion video on LCD. The application of image compression technology achieves approximately one tenth-order reduction of memory capacity.
Applied Surface Science | 1993
Eishi Gofuku; Toshio Ohnawa; Mitsuyuki Takada; Fumio Matsukawa; Masahiro Nunoshita
Abstract In the fabrication of high-speed digital integrated circuits using polyimide films as insulators, especially multi-chip modules (MCMs), via-holes of 20 μm depth have to be realized for the characteristic impedance along the signal line. When a logical scale in a near-feature engineering work station (EWS) is considered, the number of via-holes does not exceed 600 in one circuit. In this work, the authors propose the possibility of applying a third harmonic generation (THG) of a Q-switched Nd:YAG laser to drill high-aspect-ratio via-holes in such a thick polyimide film. The drilled holes as well as the excimer laser exhibit excellent configurations. The THG laser system is applicable to the fabrication process of the MCM.
Journal of Electronic Materials | 1989
Hayato Takasago; Eishi Gofuku; Mitsuyuki Takada; Yoshiyuki Morihiro
When electric resistivity of Thick Film Resistor (TFR) is adjusted to the desired value, laser beam is irradiated onto the resistor material so that a part of the resistor material is instantaneously vaporized and cut away. This conventional laser trimming method to adjust the resistivity of TFRs is an indispensable technique for manufacturing elec-tronic devices such as hybrid ICs. A peculiar phenomena was revealed by us, that is, when specially selected pulse laser beams were irradiated to TFR, the TFR was surface modified without cutting grooves, and then resistivity of the TFR was decreased. We completed the advanced laser process to apply this peculiar phenomena. 8 By comparing with conventional trimming processes, we can show prominent features of the advanced process, for example, resistivity of fine size TFR (300 micrometers-width and under) can be easily controlled. The decrease in resistivity of the TFR is considered to result from the decrease in specific resistivity of glass in the TFR. Because it is considered that the glass in the TFR is heavily doped with ruthenium impurities during the surface modification due to results of morphology observations and x-ray diffraction analysis. We have applied this advanced laser process to fine size TFR (300 micrometers-width), and developed high density hybrid ICs.
SID Symposium Digest of Technical Papers | 2000
Eishi Gofuku; Seiki Takahashi; Yoshinori Numano
15-inch Quad-VGA LCD panel which has 1,280 × 960 resolution is developed (Figure 1). This LCD panel provides adaptability to the new media such as DVD using PC because of 4/3 screen format. 15-inch diagonal size is the best selection for a personal use monitor from standpoint of ergonomics. Main features of this panel are higher brightness, higher contrast ratio, higher color saturation and smooth gray-scale to achieve excellent images especially for motion pictures on high-resolution screen using generic PC systems.
Archive | 1996
Keitarou Yamagishi; Akio Gotoh; Akihiro Miura; Eiji Mukai; Eishi Gofuku
Archive | 1998
Kunifumi Nakanishi; Masaaki Nakano; Mitsuyuki Takada; Eishi Gofuku; Mutsuhiro Shima; Toshio Ohnawa; Hirofumi Ouchida
Archive | 1994
Mitsuyuki Takada; Eishi Gofuku; Yoshikazu Narutaki; Haruo Shimamoto; Fumio Matsukawa; Masahiro Nunoshita
Archive | 1993
Hirofumi Ohuchida; Eishi Gofuku; Hayato Takasago; Akira Ishizu; Toshio Tobita; Mitsuyuki Takada