Elena Tolstosheeva

A Multi-Channel, Flex-Rigid ECoG Microelectrode Array for Visual Cortical Interfacing

High-density electrocortical (ECoG) microelectrode arrays are promising signal-acquisition platforms for brain-computer interfaces envisioned, e.g., as high-performance communication solutions for paralyzed persons. We propose a multi-channel microelectrode array capable of recording ECoG field potentials with high spatial resolution. The proposed array is of a 150 mm2 total recording area; it has 124 circular electrodes (100, 300 and 500 μm in diameter) situated on the edges of concentric hexagons (min. 0.8 mm interdistance) and a skull-facing reference electrode (2.5 mm2 surface area). The array is processed as a free-standing device to enable monolithic integration of a rigid interposer, designed for soldering of fine-pitch SMD-connectors on a minimal assembly area. Electrochemical characterization revealed distinct impedance spectral bands for the 100, 300 and 500 μm-type electrodes, and for the arrays own reference. Epidural recordings from the primary visual cortex (V1) of an awake Rhesus macaque showed natural electrophysiological signals and clear responses to standard visual stimulation. The ECoG electrodes of larger surface area recorded signals with greater spectral power in the gamma band, while the skull-facing reference electrode provided higher average gamma power spectral density (γPSD) than the common average referencing technique.

Development of a fully implantable recording system for ECoG signals

This paper presents a fully implantable neural recording system for the simultaneous recording of 128 channels. The electrocorticography (ECoG) signals are sensed with 128 gold electrodes embedded in a 10 µm thick polyimide foil. The signals are picked up by eight amplifier array ICs and digitized with a resolution of 16 bit at 10 kHz. The digitized measurement data is processed in a reconfigurable digital ASIC, which is fabricated in a 0.35 µm CMOS technology and occupies an area of 2.8×2.8mm2. After data reduction, the measurement data is fed into a transceiver IC, which transmits the data with up to 495 kbit/s to a base station, using an RF loop antenna on a flexible PCB. The power consumption of 84mW is delivered via inductive coupling from the base station.

A novel flex-rigid and soft-release ECoG array

This article addresses a novel fabrication process for an electrocorticogram (ECoG) electrode array. It consists of three regions: a flexible recording area, a flexible cable, and a rigid field for soldering the connectors. The flexible components can adapt to the curved shape of the cerebral cortex. Furthermore, the entire structure is a free-standing membrane, attached by removable polyimide straps to its carrier substrate. This configuration allows for a high level of control during soldering, electrode characterization and sterilization, as well as a soft release of the array off its carrier just before implantation. The array contains 128 gold electrodes, each 300 nm thick, sandwiched between two 5 μm thick polyimide films. The measuring area of the device is a regular hexagon with a side length of 7.2 mm, designed for implantation on the primary visual cortex of a Rhesus monkey. The flexible cable is 4 cm long. The rigid soldering area was designed for 4×32 OMNETICS connectors. The line resistance from an electrode site to the corresponding electrical connector pin is 540 Ω.

Design and fabrication of multi-contact flexible silicon probes for intracortical floating implantation

This paper reports on a novel design and process flow development for the fabrication of multi-contact silicon probes with monolithically integrated highly flexible ribbon cables on wafer level, based on the biocompatible polymer parylene-C. Compared to the state-of-the-art silicon probes, this novel development allows for the first time a floating implantation of these neural probes in the cortex with reduced destructive forces applied to the brain tissue. In-vitro electrical impedance spectroscopy measurements and first in-vivo measurements in the cortex of a rat demonstrate the functionality of these probes.

Micropatterning of nanoparticle films by bilayer lift-off

Nanostructured films are deposited by a new technique that matches supersonic cluster beam deposition with flame spray pyrolysis production of nanoparticles (FlameBeam). These films are structured with micrometric lateral resolution, applying a lift-off method by pre-structuring a photoresist-PMMA bilayer with a suitable ?mushroom-like? cross-section, depositing a nanostructured silver film on top and lifting off the bilayer in an aqueous solution. Optical inspection revealed that line-shaped microstructures, having a minimal width of up to 3??m, can be successfully obtained. The nanostructured films have survived the aqueous treatment, as demonstrated by electron microscopy imaging and electrical characterization through 4-point measurement method (Van-der-Pauw). The latter has been possible through sputtered gold pads that were realized on the substrate prior to the deposition of the photoresist and of the nanostructured film. These results disclose novel possibilities in the fine patterning of FlameBeam-deposited films and their integration into microelectromechanical systems devices in general.

Implications for a Wireless, External Device System to Study Electrocorticography

Implantable neuronal interfaces to the brain are an important keystone for future medical applications. However, entering this field of research is difficult since such an implant requires components from many different areas of technology. Since the complete avoidance of wires is important due to the risk of infections and other long-term problems, means for wirelessly transmitting data and energy are a necessity which adds to the requirements. In recent literature, many high-tech components for such implants are presented with remarkable properties. However, these components are typically not freely available for such a system. Every group needs to re-develop their own solution. This raises the question if it is possible to create a reusable design for an implant and its external base-station, such that it allows other groups to use it as a starting point. In this article, we try to answer this question by presenting a design based exclusively on commercial off-the-shelf components and studying the properties of the resulting system. Following this idea, we present a fully wireless neuronal implant for simultaneously measuring electrocorticography signals at 128 locations from the surface of the brain. All design files are available as open source.

Open Hardware: Towards a Fully-Wireless Sub-Cranial Neuro-Implant for Measuring Electrocorticography Signals

Implantable neuronal interfaces to the brain are an important keystone for future medical applications. However, entering this field of research is difficult since such an implant requires components from many different areas of technology. Since the complete avoidance of wires is important due to the risk of infections and other long-term problems, means for wireless transmitting data and energy are a necessity which adds to the requirements. In recent literature many high-tech components for such implants are presented with remarkable properties. However, these components are typically not freely available for your system. Every group needs to re-develop their own solution. This raises the question if it is possible to create a reusable design for an implant and its external base-station, such that it allows other groups to use it as a starting point. In this article we try to answer this question by presenting a design based exclusively on commercial off-the-shelf components and studying the properties of the resulting system. Following this idea, we present a fully wireless neuronal implant for simultaneously measuring electrocorticography signals at 128 locations from the surface of the brain. All design files are available as open source.

Fabrication of parylene channels embedded in silicon using a single parylene deposition step

In-situ integration of microfluidic channels into the microfabrication process flow of implantable microsystems is desirable, for example to enable efficient drug delivery. We propose a fabrication method for such microfluidic channels using parylene C, a biocompatible material whose inert nature favours water flow. A single deposition of parylene C enabled monolithical integration of fully-sealed micro-channels in a silicon substrate. The channel geometry was predefined by etching 100 μm-deep grooves into a silicon substrate. A PVC foil was fixed manually on the wafer and served as a top-cover for the grooves. The wafers were coated with the adhesion promoter AdPro Poly® and a 15 μm-thick parylene C film was deposited conformally into the grooves-foil enclosed space. The outgasing nature of the PVC foil hindered the adhesion of parylene C, allowing the foil to be peeled off easily from the parylene surface. The functionality of the fully-sealed parylene channels, embedded in the silicon wafer, was verified by injecting DI water with dispersed polystyrene microbeads (diameter 6 μm): the polystyrene beads were successfully transported along the channel. Further, a fully-sealed parylene chamber remained leak-tight throughout a stepwise application of hydrostatic pressures from 0.2 to 3.0 bar (15 s step-interval). In short, our parylene channels are: (1) suitable for microsystem drug-delivery; (2) in-situ enclosed hollow spaces embedded in the silicon substrate, realized with a single parylene deposition; (3) intact at hydrostatic pressures up to 3 bar.

Embedding without disruption: The basic challenge of sensor integration

The basic challenge in embedding sensors in materials is meet simultaneously two conflicting requirements: On the one hand, we want to retrieve sensor data from the material, thus we have to integrate sensors and interconnections. On the other hand, sensors are foreign bodies in the material, which may deteriorate its macroscopic properties. This paper discusses several possibilities to integrate sensors in material avoiding subsequent deterioration of its macroscopic performance. It is our idea to reduce the volume of the sensor to the minimum which is needed to guarantee the function. This approach is called function scale integration. Two examples for material integrated MEMS devices will be discussed in this paper. The first one is a thermoelectric energy harvester, embedded in aluminum during the casting process. The second example is a thin and flexible foil sensor which can monitor the process of polymerization of a compound material. These sensors represent the first step towards function scale integration.