Eli Chiprout

Efficient full-wave electromagnetic analysis via model-order reduction of fast integral transforms

An efficient full-wave electromagnetic analysis tool would be useful in many aspects of engineering design. Development of integral-equation based tools has been hampered by the high computational complexity of dense matrix representations and difficulty in obtaining and utilizing the frequency-domain response. In this paper we demonstrate that an algorithm based on application of a novel model-order reduction scheme directly to the sparse model generated by a fast integral transform has significant advantages for frequency- and time-domain simulation.

Interconnect and substrate modeling and analysis: an overview

Accurate models for on-chip metal interconnect, silicon substrate, and packaging have become necessary for accurate simulation of high-performance ULSI circuits and high-speed RF designs. An overview of the hierarchy of techniques used to model and simulate these structures is given. While not an exhaustive summary, the purpose of the paper is to give the designer fundamental and practical understanding of principles used in modeling and analysis. The range of techniques from three-dimensional (3-D) modeling to quasi-3-D to transmission lines are analyzed, and their importance and impact are described. A modeling strategy that can include various kinds of modeling techniques and nonlinear devices in one simulation is also described.

SRC physical design top ten problem

Transistor density on an integrated circuit continues to grow at an exponential rate. The associated complexities when applied to synthesis, layout, and timing analysis will become untenable within the framework of our current technological capabilities. This paper briefly outlines the problems facing the semiconductor industry early into the next decade. A SRC research thrust team consisting of members from various companies prioritized these problems and established a top ten list. This paper includes both problem descriptions as well as metrics to benchmark proposed solutions.

Physical design challenges for performance

Recent trends in high performance microprocessor design suggest that complex gigahertz processors based on deep-submicron CMOS technologies will be practical in the near future. It is also certain that integration complexity will result in ever-increasing demand for interconnection connectivity and bandwidths. Front-end chip planning, back-end interconnect design, and global electrical analysis issues will be at the forefront.