Eric L. Mears

New method of solid state wafer cooling in the Extrion 1000 high current ion implantation system

Abstract A new method of wafer cooling during implantation has been developed which meets the process needs of the 1990s. Cooling levels four times better than existing gas cooling techniques are achieved in a clampless, low stress system designed for high beam power. A new antistick technology is described which reduces particle contaminations and wafer breakage.

The Extrion 1000: A new high current ion implantation system for automated fabrication environments and intelligent process control

Abstract The next generation of ion implantation systems will require new techniques for intelligent process control while satisfying the increasing need for high reliability and serviceability. The Extrion 1000, a new Varian batch process ion implantation system designed to address these needs, is described. The new implanter features extensive real time process monitoring capability, failure prediction technology, wide dynamic range, and rapid changeover between processes requiring different implant angles or wafer sizes. Adaptive control techniques are used within the framework of an automated fabrication environment to assure high yield and throughput.

A vacuum exchange end station for a new batch process ion implantation system

Abstract A new generation ion implantation machine has recently been designed which employs batch process and vacuum exchange technology. This paper will describe the end station of the Extrion 1000 and talk specifically about the mechanical components and subsystems which make up the assembly.