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Erik Heinemann

Infineon Technologies

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Publication

Featured researches published by Erik Heinemann.

Archive | 2004

Making contact with semiconductor chips in chip cards

Erik Heinemann; Frank Pueschner

Archive | 2002

Method for producing laminated smart cards

Erik Heinemann; Frank Püschner

Archive | 2007

CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE

Erik Heinemann; Andreas Mueller-Hipper; Frank Pueschner; Thomas Spoetti

Archive | 2006

Chip module and chip card

Peter Stampka; Frank Püschner; Erik Heinemann; Birgit Binder

Archive | 2004

Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formed

Bernd Barchmann; Erik Heinemann; Josef Heitzer; Frank Püschner

Archive | 2001

Production method for laminated chip cards

Erik Heinemann; Frank Püschner

Archive | 2000

Method for producing a chip module

Frank Püschner; Jürgen Fischer; Erik Heinemann

Archive | 2002

Bonding of semiconductor chips in chip cards

Erik Heinemann; Frank Pueschner

Archive | 2000

Method for producing a chip card module

Jürgen Fischer; Erik Heinemann; Frank Püschner

Archive | 2008

Chip card module comprises substrate and two sides, where conducting structures are placed on sides of substrate in adhesion free manner, and chip is arranged on sides of substrate

Erik Heinemann; Andreas Müller-Hipper; Frank Püschner; Thomas Spöttl

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Collaboration

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Frank Püschner

Infineon Technologies

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Frank Pueschner

Infineon Technologies

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Bernd Barchmann

Infineon Technologies

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Josef Heitzer

Infineon Technologies

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Stephan Franz Janka

Infineon Technologies

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Birgit Binder

Infineon Technologies

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Detlef Houdeau

Infineon Technologies

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Jürgen Fischer

Infineon Technologies

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Peter Stampka

Infineon Technologies

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Thomas Spöttl

Infineon Technologies

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