Erin C. H. Kyle

Proton-Induced Dehydrogenation of Defects in AlGaN/GaN HEMTs

The responses to 1.8 MeV proton irradiation of AlGaN/GaN HEMTs grown under Ga-rich and ammonia-rich conditions are investigated in this work. Changes in defect energy distributions of AlGaN/GaN HEMTs during proton irradiation are characterized via temperature-dependent low-frequency noise measurements. Density functional theory calculations show these changes are consistent with the reconfiguration and/or dehydrogenation of oxygen-related defects in Ga-rich devices.

GaN-based high-electron-mobility transistor structures with homogeneous lattice-matched InAlN barriers grown by plasma-assisted molecular beam epitaxy

Metal-polar In0.17Al0.83N barriers, lattice-matched to GaN, were grown under N-rich conditions by plasma-assisted molecular beam epitaxy. The compositional homogeneity of these barriers was confirmed by plan-view high-angle annular dark-field scanning transmission electron microscopy and atom probe tomography. Metal-polar In0.17Al0.83N/(GaN)/(AlN)/GaN structures were grown with a range of AlN and GaN interlayer (IL) thicknesses to determine the optimal structure for achieving a low two-dimensional electron gas (2DEG) sheet resistance. It was determined that the presence of a GaN IL was necessary to yield a 2DEG sheet density above 2 × 10 13 cm −2 . By including AlN and GaN ILs with thicknesses of 3 nm and 2 nm, respectively, a metal-polar In0.17Al0.83N/GaN/AlN/GaN structure regrown on a GaN-on-sapphire template yielded a room temperature (RT) 2DEG sheet resistance of 163 � /. This structure had a threading dislocation density (TDD) of ∼5 × 10 8 cm −2 . Through regrowth on a free-standing GaN template with low TDD (∼5 × 10 7 cm −2 ), an optimized metal-polar In0.17Al0.83N/GaN/AlN/GaN structure achieved a RT 2DEG sheet resistance of 145 � / and mobility of 1822 cm 2 V −1 s −1 . High-electron-mobility transistors with output current densities above 1 A mm −1 were also demonstrated on the low-TDD

Effect of dislocations on electron mobility in AlGaN/GaN and AlGaN/AlN/GaN heterostructures

AlxGa1−xN/GaN (x = 0.06, 0.12, 0.24) and AlGaN/AlN/GaN heterostructures were grown on 6 H-SiC, GaN-on-sapphire, and free-standing GaN, resulting in heterostructures with threading dislocation densities of ∼2 × 1010, ∼5 × 108, and ∼5 × 107 cm−2, respectively. All growths were performed under Ga-rich conditions by plasma-assisted molecular beam epitaxy. Dominant scattering mechanisms with variations in threading dislocation density and sheet concentration were indicated through temperature-dependent Hall measurements. The inclusion of an AlN interlayer was also considered. Dislocation scattering contributed to reduced mobility in these heterostructures, especially when sheet concentration was low or when an AlN interlayer was present.

High-electron-mobility GaN grown on free-standing GaN templates by ammonia-based molecular beam epitaxy

The dependence of electron mobility on growth conditions and threading dislocation density (TDD) was studied for n−-GaN layers grown by ammonia-based molecular beam epitaxy. Electron mobility was found to strongly depend on TDD, growth temperature, and Si-doping concentration. Temperature-dependent Hall data were fit to established transport and charge-balance equations. Dislocation scattering was analyzed over a wide range of TDDs (∼2 × 106 cm−2 to ∼2 × 1010 cm−2) on GaN films grown under similar conditions. A correlation between TDD and fitted acceptor states was observed, corresponding to an acceptor state for almost every c lattice translation along each threading dislocation. Optimized GaN growth on free-standing GaN templates with a low TDD (∼2 × 106 cm−2) resulted in electron mobilities of 1265 cm2/Vs at 296 K and 3327 cm2/Vs at 113 K.

Pure AlN layers in metal-polar AlGaN/AlN/ GaN and AlN/GaN heterostructures grown by low-temperature ammonia-based molecular beam epitaxy

When grown at a high temperature (820 °C) by ammonia-based molecular beam epitaxy (NH3-MBE), the AlN layers of metal-polar AlGaN/AlN/GaN heterostructures had a high GaN mole fraction (~0.15), as identified by atom probe tomography in a previous study (Mazumder et al 2013 Appl. Phys. Lett. 102 111603). In the study presented here, growth at low temperature (<740 °C) by NH3-MBE yielded metal-polar AlN layers that were essentially pure at the alloy level. The improved purity of the AlN layers grown at low temperature was correlated to a dramatic increase in the sheet density of the two-dimensional electron gas (2DEG) at the AlN/GaN heterointerface. Through application of an In surfactant, metal-polar AlN(3.5 nm)/GaN and AlGaN/AlN(2.5 nm)/GaN heterostructures grown at low temperature yielded low 2DEG sheet resistances of 177 and 285 Ω/, respectively.

RF Performance of Proton-Irradiated AlGaN/GaN HEMTs

AlGaN/GaN high electron mobility transistors (HEMTs) irradiated with 1.8-MeV protons show more relative degradation in RF power/current gain, cutoff frequency fT, and maximum oscillation frequency fmax than DC transconductance. These result from radiation-induced increases in fast bulk and surface trap densities, as well as increasing impedance mismatch at high frequencies with increasing proton fluence. NH3-rich MBE devices show less degradation in DC transconductance, but more degradation in RF gain than Ga-rich devices.

Increased p-type conductivity through use of an indium surfactant in the growth of Mg-doped GaN

We have examined the effect of an indium surfactant on the growth of p-type GaN by ammonia-based molecular beam epitaxy. p-type GaN was grown at temperatures ranging from 700 to 780 °C with and without an indium surfactant. The Mg concentration in all films in this study was 4.5–6 × 1019 cm−3 as measured by secondary ion mass spectroscopy. All p-type GaN films grown with an indium surfactant had higher p-type conductivities and higher hole concentrations than similar films grown without an indium surfactant. The lowest p-type GaN room temperature resistivity was 0.59 Ω-cm, and the highest room temperature carrier concentration was 1.6 × 1018 cm−3. Fits of the temperature-dependent carrier concentration data showed a one to two order of magnitude lower unintentional compensating defect concentration in samples grown with the indium surfactant. Samples grown at higher temperature had a lower active acceptor concentration. Improvements in band-edge luminescence were seen by cathodoluminescence for samples gr...

Correlation of proton irradiation induced threshold voltage shifts to deep level traps in AlGaN/GaN heterostructures

The impact of proton irradiation on the threshold voltage (VT) of AlGaN/GaN heterostructures is systematically investigated to enhance the understanding of a primary component of the degradation of irradiated high electron mobility transistors. The value of VT was found to increase monotonically as a function of 1.8 MeV proton fluence in a sub-linear manner reaching 0.63 V at a fluence of 1 × 1014 cm−2. Silvaco Atlas simulations of VT shifts caused by GaN buffer traps using experimentally measured introduction rates, and energy levels closely match the experimental results. Different buffer designs lead to different VT dependences on proton irradiation, confirming that deep, acceptor-like defects in the GaN buffer are primarily responsible for the observed VT shifts. The proton irradiation induced VT shifts are found to depend on the barrier thickness in a linear fashion; thus, scaling the barrier thickness could be an effective way to reduce such degradation.

Thermal stability of deep level defects induced by high energy proton irradiation in n-type GaN

The impact of annealing of proton irradiation-induced defects in n-type GaN devices has been systematically investigated using deep level transient and optical spectroscopies. Moderate temperature annealing (>200–250 °C) causes significant reduction in the concentration of nearly all irradiation-induced traps. While the decreased concentration of previously identified N and Ga vacancy related levels at EC − 0.13 eV, 0.16 eV, and 2.50 eV generally followed a first-order reaction model with activation energies matching theoretical values for NI and VGa diffusion, irradiation-induced traps at EC − 0.72 eV, 1.25 eV, and 3.28 eV all decrease in concentration in a gradual manner, suggesting a more complex reduction mechanism. Slight increases in concentration are observed for the N-vacancy related levels at EC − 0.20 eV and 0.25 eV, which may be due to the reconfiguration of other N-vacancy related defects. Finally, the observed reduction in concentrations of the states at EC − 1.25 and EC − 3.28 eV as a functi...

Proton irradiation effects on deep level states in Mg-doped p-type GaN grown by ammonia-based molecular beam epitaxy

The impact of proton irradiation on the deep level states throughout the Mg-doped p-type GaN bandgap is investigated using deep level transient and optical spectroscopies. Exposure to 1.8 MeV protons of 1 × 1013 cm−2 and 3 × 1013 cm−2 fluences not only introduces a trap with an EV + 1.02 eV activation energy but also brings monotonic increases in concentration for as-grown deep states at EV + 0.48 eV, EV + 2.42 eV, EV + 3.00 eV, and EV + 3.28 eV. The non-uniform sensitivities for individual states suggest different physical sources and/or defect generation mechanisms. Comparing with prior theoretical calculations reveals that several traps are consistent with associations to nitrogen vacancy, nitrogen interstitial, and gallium vacancy origins, and thus are likely generated through displacing nitrogen and gallium atoms from the crystal lattice in proton irradiation environment.