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Ernest J. Russell

Texas Instruments

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Publication

Featured researches published by Ernest J. Russell.

Archive | 1997

Semiconductor package having interdigitated leads

Ernest J. Russell

Archive | 1996

Reduced capacitance lead frame for lead on chip package

Ernest J. Russell

Archive | 1996

Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity

Ernest J. Russell

Archive | 1996

Method for a hybrid leadframe-over-chip semiconductor package

Ernest J. Russell

Archive | 1994

High power dissipation vertical mounted package for surface mount application

Ernest J. Russell; Daniel Baudouin; James S. Wallace

Archive | 1995

Process for manufacturing a semiconductor package having two rows of interdigitated leads

Ernest J. Russell

Archive | 1995

Integrated circuit lead frame for coupling to non-neighboring bond pads

Ernest J. Russell

Archive | 1998

Vertical passive components for surface mount assembly

Daniel Baudouin; Ernest J. Russell; Jeffrey W. Janzen

Archive | 2001

Lead frame device for delivering electrical power to a semiconductor die

Ernest J. Russell

Archive | 1993

Ceramic bonding bridge

Ernest J. Russell

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Daniel Baudouin

Texas Instruments

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James S. Wallace

Texas Instruments

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Jeffrey W. Janzen

Texas Instruments

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