Erwin Bosman

UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology

Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.

Ultrathin Optoelectronic Device Packaging in Flexible Carriers

This paper presents the development of an advanced packaging technique for commercially available optoelectronic devices. Vertical cavity surface emitting laser (VCSEL) diodes and photodiodes are thinned down to 20 μm thickness, and are embedded in flexible carriers, resulting in a 75-μm-thin package, which can be bent down to a bending radius of 2 mm. Electrical, optical, and mechanical characterization addresses the influence of thinning and embedding of bare optoelectronic chips on their main properties. Next to the embedded optoelectronics, also electrical ICs like amplifiers and drivers can be housed in the same thin flexible package, using an identical technology and layer build-up. Finally, this new packaging approach is demonstrated in two different integrated sensor applications and in an integrated optical interconnection. For the latter application, also waveguides and optical out-of-plane coupling elements are integrated in the package and the complete system reliability is assessed by accelerated aging tests.

Stretchable optical waveguides

We introduce the concept of mechanically stretchable optical waveguides. The technology to fabricate these waveguides is based on a cost-efficient replication method, employing commercially available polydimethylsiloxane (PDMS) materials. Furthermore, VCSELs (λ = 850 nm) and photodiodes, embedded in a flexible package, were integrated with the waveguides to obtain a truly bendable, stretchable and mechanically deformable optical link. Since these sources and detectors were integrated, it was possible to determine the influence of bending and stretching on the waveguide performance.

Highly Reliable Flexible Active Optical Links

We present a process to embed commercially available optical material layers into a flexible foil. Patterning of the embedded layers results in highly transparent low loss flexible waveguides. Bending of the foil down to a bending radius of 5 mm causes no additional optical propagation losses. Vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes are thinned down to 20 ¿m and embedded inside the cladding layer of the waveguides. They are optically coupled with the use of embedded micro-mirrors. The result is a thin foil of 150- ¿m thickness with embedded active optical low-loss links. Accelerated aging tests prove the reliability of the embedded optical links exposed to humidity and temperature cycling.

Ultra Small Integrated Optical Fiber Sensing System

This paper introduces a revolutionary way to interrogate optical fiber sensors based on fiber Bragg gratings (FBGs) and to integrate the necessary driving optoelectronic components with the sensor elements. Low-cost optoelectronic chips are used to interrogate the optical fibers, creating a portable dynamic sensing system as an alternative for the traditionally bulky and expensive fiber sensor interrogation units. The possibility to embed these laser and detector chips is demonstrated resulting in an ultra thin flexible optoelectronic package of only 40 μm, provided with an integrated planar fiber pigtail. The result is a fully embedded flexible sensing system with a thickness of only 1 mm, based on a single Vertical-Cavity Surface-Emitting Laser (VCSEL), fiber sensor and photodetector chip. Temperature, strain and electrodynamic shaking tests have been performed on our system, not limited to static read-out measurements but dynamically reconstructing full spectral information datasets.

Embedded flexible optical shear sensor

Monitoring shear stresses is increasingly important in the medical sector, where the sensors need to be unobtrusive, compact and flexible. A very thin and flexible sensor foil is presented based on the shear stress dependent coupling change of optical power between a laser and photodiode chip that were separated by a deformable sensing layer. These opto-electronic components were embedded in a very thin foil of only 40µm thick. The sensitivity and measurement range can be modified by selecting the material properties of the sensing layer. The sensor response showed to be reproducible and the influence of normal pressure on the sensor was very limited.

Novel coupling and packaging approaches for optical interconnects

We present the design and fabrication of a complete optical interconnection scheme including the optoelectronic package, containing driving Vertical Cavity Surface Emitting Lasers (VCSELs) and read-out photodiode (PDs), the coupling scheme of the fiber or waveguide interconnect and the fabrication technology of the waveguide structures itself. Both the optoelectronic package and the waveguide part are fabricated using polymer materials resulting in a low-cost, flexible interconnection scheme. The optoelectronic package consists of an ultra-thin (20 μm) chip embedded in a flexible polymer stack, connected through metalized microvias using thin film deposition steps. A 45° deflecting micromirror is used to couple this optoelectronic package to an optical fiber or an optical waveguide. The waveguiding structures can be integrated with the coupling plug leading to a 1 step alignment process which significantly reduces the coupling losses. Flexible and stretchable multimode polymer waveguides are also developed to end up with a fully flexible optical interconnect for short (waveguide) or long distance (fiber) communication or for application in sensing.

Optical fiber sensors embedded in flexible polymer foils

In traditional electrical sensing applications, multiplexing and interconnecting the different sensing elements is a major challenge. Recently, many optical alternatives have been investigated including optical fiber sensors of which the sensing elements consist of fiber Bragg gratings. Different sensing points can be integrated in one optical fiber solving the interconnection problem and avoiding any electromagnetical interference (EMI). Many new sensing applications also require flexible or stretchable sensing foils which can be attached to or wrapped around irregularly shaped objects such as robot fingers and car bumpers or which can even be applied in biomedical applications where a sensor is fixed on a human body. The use of these optical sensors however always implies the use of a light-source, detectors and electronic circuitry to be coupled and integrated with these sensors. The coupling of these fibers with these light sources and detectors is a critical packaging problem and as it is well-known the costs for packaging, especially with optoelectronic components and fiber alignment issues are huge. The end goal of this embedded sensor is to create a flexible optical sensor integrated with (opto)electronic modules and control circuitry. To obtain this flexibility, one can embed the optical sensors and the driving optoelectronics in a stretchable polymer host material. In this article different embedding techniques for optical fiber sensors are described and characterized. Initial tests based on standard manufacturing processes such as molding and laser structuring are reported as well as a more advanced embedding technique based on soft lithography processing.

Fully Flexible Optoelectronic Foil

In this paper, we present a process to embed commercially available optical material layers into a flexible foil. Patterning of the embedded layers results in highly transparent low-loss flexible waveguides. Bending of the foil down to a bending radius of 5 mm causes no additional optical propagation losses. Vertical cavity surface emitting lasers and photodiodes are thinned down to 20 m and are embedded inside the cladding layer of the waveguides. They are optically coupled with the use of embedded micromirror plugs. The result is a thin foil of 150 m thickness with embedded active optical low-loss links. The presented links show an average total optical loss of 6.4 dB and a clear open-eye diagram at 1.2 Gb/s. The foil characteristics do not change after humidity and temperature cycling.

Multiple chip integration for flat flexible electronics

These days, there is a lot of interest for making electronic devices lighter and compacter, as the electronics market is rapidly expanding with all sorts of portable devices for home and everyday use. Here, a technology for embedding single thin chips in flexible substrates is further investigated so that several chips might be integrated within the same substrate. This technology offers the possibility of reducing weight, while at the same time enhancing the mechanical flexibility of the electronic circuitry. Such an integration is particularly interesting in the area of flexible displays, where the flexibility of the display is too often hampered by the rigidity of its driving electronics.