Ewa Raj

Cooling Microstructure for Automotive Electronic Module

The paper presents the general overview of the cooling microstructure concept dedicated for automotive electronic systems. It introduces the first design stage of the micro heat sink and presents preliminary simulations that consider adaptation of automotive coolants. The theoretical discussion is supported by simulations and calculations that were led with the aid of ANSYS software.

The numerical approach to analysis of microchannel cooling systems

The paper deals with microchannel cooling where water is the cooling liquid. ANSYS software and CFDRC-ACE one were used to analyse the flows and the origin of large amount of heat that can be overtaken from the chip when microchannels are applied. The concept of microscale heat transfer coefficient is discussed. The phenomena taking place in microchannel flows are simulated and some conclusions are introduced to explain the results met in many references but still unexplained. In contrast to existing, standard methods, the new approach describes the local phenomena and is used in the further investigation of the cooling microstructure. An effect of its geometry on the total overtaken heat flux is analysed with respect to optimal conditions as well as to technological restrictions.

Simulations for thermal analysis of MOSFET IPM using IMS substrate

The project was focused on the thermal aspects of the new IPM module design. The investigations were aimed to estimate the influence of the particular design of the MOSFET transistor location versus the steady-state thermal feature of the considered IPM and to determinate its thermal impedance as well as to evaluate its equivalent RC network (ladder) model. It required working out the 3-D thermal model of the considered system that was used in numerical simulations and next, tested with commercial software, ANSYS 5.7 based on Finite Element Method (FEM).

Dynamic simulations for thermal analysis of MOSFET IPM on IMS substrate

The authors introduce some further research on the problem depicted in [1]. The transient model has been worked out to check how rapidly the temperature of the chip changes when the applied power changes abruptly This means searching for the answer: how the thermal resistance and the maximum temperature vary versus time. The simulations required using the 3-D thermal model of considered system that was used in numerical simulations and next, tested with commercial software, ANSYS 5.7 based on Finite Element Method (FEM) and additional calculations.

Numerical procedure for liquid cooling optimisation

The paper presents brief analysis of efficiency of micro heat sink containing several channels with rectangular cross-section. The authors focus mainly on the ratio of channels width to columns thickness that influence on the amount of heat that can be taken over. The simulations and calculations were supported by ANSYS software.