Fang Daining

Finite Element Modeling of 3D Orthogonal Woven C/C Composite Based on Micro-Computed Tomography Experiment

AbsractTwo-dimensional images of C/C 3D orthogonal woven composite were captured by X-ray micro-computed tomography (μCT). The μCT data reveal comprehensive meso-geometrical information about the carbon fiber tows, carbon matrix, and void defects etc. The fibers tows are characterized consisting of the cancroids of a tow, the area and aspect ratio of its cross-section. A statistical analysis of the volume fraction and positioning of the void defects in the 3D orthogonal woven architecture is performed based on 2-D micro tomography images. The tabulated statistics are sufficient to generate the virtual specimen, which shares the same statistical characteristics of the C/C composite and the void defects are included. Three-point bending experiment and simulation are carried out and the results show that the finite element model including the void defects gives more accurate results. The finite element model will give some highlights to the numerical simulation approach of the C/C textile composite under thermal, mechanical and oxygen coupled service environment. And the numerical techniques for modelling such kind materials with woven architecture and void defects are recommended.

Numerical Analysis of Thermodynamic Behaviour of Through-Thickness Stitched Sandwich Laminate

Effects of stitching angle on mechanical properties, thermal protection capability and induced thermal stress of stitched sandwich laminate (SSL) are numerically analyzed by ABAQUS codes. Interest centers on the potential for microcracking in the vicinity of the through-thickness stitches and the skins/foam interfaces. Two numerical models, in-depth heat transfer and thermoelastic deformation, are coupled to yield the transient response of the SSL. Six different stitching angles are considered and the simulation results showed that: the heat conductivity ability of the SSL is improved as the stitching angle increasing, which alters the mechanical behaviour and the thermal stress state of the SSL.