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Dive into the research topics where Fang Hongyuan is active.

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Featured researches published by Fang Hongyuan.


Science and Technology of Welding and Joining | 2005

New general double ellipsoid heat source model

Fang Hongyuan; Meng Qingguo; Xu Wenli; Ji Shude

Abstract Based on the tridimensional Gauss distribution of power density, a general double ellipsoid welding heat source model has been developed. This model not only consists of all the characteristics of a double ellipsoid model, but also can deal with the situation where, under an external disturbance, the arcs backbone is not perpendicular to the work surface. This general double ellipsoid model is validated by measured results of the temperature field during twin wire welding. Using the non-linear finite element software Marc, the temperature field during twin wire welding was calculated using both the double ellipsoid heat source and the general double ellipsoid heat source. The thermal cycling curves and the weld pool cross-section obtained by the general double ellipsoid heat source tally well with the experimental results.


international conference on electronic packaging technology | 2015

The research on the resistance of electromigration of different connection form

Zhao Zhili; Ge Qi; Fang Hongyuan; Zhang Yuanjian; Wenqin Dai; Liu Yingjie; Jia Zhou

For the purpose to start the requirement on the mechanical and the electromigration reliabilities, this paper take the study on the electromigration on Cu Column Grid Array(CuCGA) and Ball Grid Array(BGA). In order to eliminate the influence by the heat migration, the study build and simulate the two models which contain the distribution of current density and temperature of the two connection form by using the software MSC.MARC. Then design the one integrated circuit to fulfill the current density which is more than 104A/cm2. And take the experiment that the current density is 1.21×103A/cm2, the electric time is 0h,50h, 100h,150h,200h respectively. Take and observe the metallographic diagram at last. The result shows that the peak value on current density and temperature appear at the joint interface between pad and solder. The peak value of current density and temperature of CuCGA is higher than BGAs since the average current density on pad is same. While the average current density keeps 1.21×103 A/cm2, the resistance on electromigration of CuCGA joints is weaker than the BGAs joints.


Archive | 2004

Mechanical alloying preparation method of ceramic grain reinforced composite solder

Fang Hongyuan; Yang Jianguo; Hu Junfeng


Archive | 2013

Device for testing tension of test piece

Liu Xuesong; Pan Haibo; Yan Zhongjie; Shang Zhe; Wang Wei; Dong Zhibo; Fang Hongyuan


Archive | 2004

Ceramic particle reinforced composite brazing alloy used for ceramic soldering

Fang Hongyuan; Yang Jianguo; Wan Xin


Archive | 2013

Method for deducing stress intensity factor of butt joint containing I-type center bursts and application

Yang Jianguo; Wang Tao; Fang Hongyuan; Liu Xuesong; Dong Zhibo; Zhang Yong; Zhang Jingqiang; Wang Jiajie


Archive | 2013

Soldered joint stress concentration testing device and stress concentration testing method based on laser speckle technology

Liu Xuesong; Pan Haibo; Yan Zhongjie; Shang Zhe; Wang Shuaili; Wang Qiang; Li Shuqi; Wang Wei; Dong Zhibo; Fang Hongyuan


Transactions of the China Welding Institution | 2011

Mechanism of cold welding cracks in 30CrMnSi steel joints welded by TIG method

Fang Hongyuan


中国有色金属学会会刊(英文版) | 2005

Numerical simulation and welding stress and distortion control of titanium alloy thin plate

Fang Hongyuan


Archive | 2014

Multi-layer and multi-pass welding-with-trailing-hammering method

Fang Kun; Yang Jianguo; Fang Hongyuan; Liu Xuesong; Dong Zhibo; Ma Ran; Peng Xiaoyi

Collaboration


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Liu Xuesong

Harbin Institute of Technology

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Yang Jianguo

Harbin Institute of Technology

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Dong Zhibo

Harbin Institute of Technology

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Qian Yiyu

Harbin Institute of Technology

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Jiang Yihong

Harbin Institute of Technology

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Xu Wenli

Harbin Institute of Technology

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Xu Wei

Harbin Institute of Technology

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Zhao Zhili

Harbin University of Science and Technology

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Cui Wei

Harbin Institute of Technology

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Ge Qi

Harbin University of Science and Technology

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