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Dive into the research topics where Fengyi Jiang is active.

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Featured researches published by Fengyi Jiang.


Applied Physics Letters | 2009

Giant enhancement of top emission from ZnO thin film by nanopatterned Pt

Kewei Liu; Yuxin Tang; Chunxiao Cong; Tze Chien Sum; A. C. H. Huan; Zexiang Shen; Lan Wang; Fengyi Jiang; Xiao Wei Sun; Handong Sun

The authors report the enhancement of the bandgap emission from ZnO thin films by surface modification and surface plasmon cross-coupling. 12-fold and twofold enhancements of bandgap emission from the metal side of ZnO film were observed by sputtering Pt nanopattern and Pt film onto ZnO film, respectively. Time-resolved photoluminescence indicates that the decay time is slowed down by Pt capping, contrary to common observations. The “abnormal” phenomena are interpreted by considering both the surface modification and surface plasmon coupling.


Journal of Applied Physics | 2014

Roles of V-shaped pits on the improvement of quantum efficiency in InGaN/GaN multiple quantum well light-emitting diodes

Zhijue Quan; Li Wang; Changda Zheng; Junlin Liu; Fengyi Jiang

The roles of V-shaped pits on the improvement of quantum efficiency in InGaN/GaN multiple quantum well (MQW) light-emitting diodes are investigated by numerical simulation. The simulation results show that V-shaped pits cannot only screen dislocations, but also play an important role on promoting hole injection into the MQWs. It is revealed that the injection of holes into the MQW via the sidewalls of the V-shaped pits is easier than via the flat region, due to the lower polarization charge densities in the sidewall structure with lower In concentration and {10–11}-oriented semi-polar facets.


CrystEngComm | 2013

Effects of AlN interlayer on growth of GaN-based LED on patterned silicon substrate

Junlin Liu; Jianli Zhang; Qinghua Mao; Xiaoming Wu; Fengyi Jiang

GaN-based light emitting diodes (LEDs) were grown on 1 mm × 1 mm patterned 2-inch and 6-inch Si (111) substrates by metal–organic vapour phase epitaxy (MOVPE). AlN interlayers with different thicknesses were introduced between the composition-graded AlGaN buffer layer and the GaN seed layer in different LED structures. The crystalline quality, wavelength uniformity and crack density of the 2-inch wafer were improved by increasing the AlN interlayer thickness. With a 30 nm AlN interlayer, a crack-free, smooth and reflective 6-inch LED wafer was grown, the full width at half maximum (FWHM) of the XRD rocking curves of GaN (002) and GaN (102) planes were 384 and 432 arcsec, respectively. The standard deviation of thickness and dominant wavelength were 0.03 μm (average thickness was 3.84 μm) and 1.52 nm (average dominant wavelength was 457.9 nm), respectively. The AlN interlayer can change the growth mode of the GaN seed layer and subsequent n-GaN, which changes the density of dislocation and the residual tensile stress of the GaN film. A smaller residual tensile stress in the GaN film can help to reduce bowing of the wafer, improve the wavelength uniformity, and suppress the generation of cracks.


Journal of Luminescence | 2001

The influence of Si-doping to the growth rate and yellow luminescence of GaN grown by MOCVD

Shuti Li; Chunlan Mo; Li Wang; Chuanbing Xiong; Xuexin Peng; Fengyi Jiang; Zhenbo Deng; Dawei Gong

The growth of Si-doped GaN films was performed by MOCVD using a homemade reactor operating at atmospheric pressure on (0 0 0 1) oriented sapphire. A study of the effect of Si-doping indicated that the intensity of yellow band emission in GaN : Si films decreased with the increasing of SiH4/TMGa ratio, and it was largely influenced by the parasitic reactions in the gas phase. The yellow band intensity was depressed when the parasitic reactions were reduced. We also observed that the growth rate of GaN : Si films was influenced by the Si doping and the parasitic reactions. The growth rate decreased with the increase of SiH4/TMGa ratio and was larger in larger parasitic reactions reactor. Sidoped GaN films with carrier concentration of 2 10 19 cm @3 , electron mobility of 120 cm 2 /V s, FWHM of the bandedge emission of only 60 meV at room temperature, and no yellow emission were obtained. r 2001 Elsevier Science


Applied Physics Letters | 2014

Electroluminescence from the sidewall quantum wells in the V-shaped pits of InGaN light emitting diodes

Xiaoming Wu; Junlin Liu; Zhijue Quan; Chuanbing Xiong; Changda Zheng; Jianli Zhang; Qinghua Mao; Fengyi Jiang

InGaN/GaN multi-quantum well (MQW) light emitting diodes with heavily Mg doped and unintentionally doped (UID) low-temperature Al0.2Ga0.8N electron blocking layer (EBL) were investigated. Broad short-wavelength electroluminescence peak, which has strong relative intensity to the main emission, was found in the UID-EBL sample at cryogenic temperatures. Study suggests that the broad peak is emitted by the sidewall MQWs. This result indicates that the electroluminescence of sidewall MQWs, in which the carrier density is high enough, can be detected at cryogenic temperatures. The lineshape variation with current density reveals detailed information on the process of carrier injection into the sidewall MQWs.


Journal of Applied Physics | 2013

The effect of silicon doping in the barrier on the electroluminescence of InGaN/GaN multiple quantum well light emitting diodes

Xiaoming Wu; Junlin Liu; Chuanbing Xiong; Jianli Zhang; Zhijue Quan; Qinghua Mao; Fengyi Jiang

InGaN/GaN multiple quantum well (MQW) light emitting diodes were grown on silicon substrate by metal organic chemical vapor deposition. A different barrier was heavily doped with silicon based on the same structure. Temperature dependent electroluminescence was performed on the devices. The results reveal that heavily doping the barrier distant from the n-type layer with silicon causes two emission peaks. As the doped barrier gets closer to n-type layer, the energy gap between the two peaks becomes narrower. Silicon doped in the barrier is believed to generate p-n junction built-in field from the doped barrier towards p-type layer. This field compensates the piezoelectric field in the well(s) between the doped barrier and p-type layer. It results in higher emission energy of this (these) well(s). When the doped barrier gets closer to the n-type layer, the compensation is less significant.


Journal of Crystal Growth | 1998

MOCVD growth of MgSe thin films on GaAs substrates

Fengyi Jiang; Qinghua Liao; Guanghan Fan; Chuanbing Xiong; Xuexin Peng; Chuankang Pan; Nianhua Liu

MgSe thin films have been grown by metal-organic chemical vapor deposition on GaAs substrates. Our experimental results show that the crystal structure of MgSe depends strongly on both the growth temperature and the substrate orientation. Using the X-ray diffraction technique, we observed the three phases of MgSe; the rock salt, wurtzite and zincblende structures. The lattice constant of zincblende MgSe was determined to be 5.96 A.


Journal of Applied Physics | 2015

Hole injection from the sidewall of V-shaped pits into c-plane multiple quantum wells in InGaN light emitting diodes

Xiaoming Wu; Junlin Liu; Fengyi Jiang

The role which the V-shaped pits (V-pits) play in InGaN/GaN multiple quantum well (MQW) light emitting diodes (LEDs) has been proposed to enable the formation of sidewall MQWs, whose higher bandgap than that of the c-plane MQWs is considered to act as an energy barrier to prevent carriers from reaching the dislocations. Here, with increasing proportion of current flowing via the V-pits, the emission of the c-plane MQWs broadens across the short-wavelength band and shows a blueshift successively. This phenomenon is attributed to hole injection from the sidewall of V-pits into the c-plane MQWs, which is a new discovery in the injection mechanism of InGaN/GaN MQW LEDs.


Journal of Applied Physics | 2015

A new interpretation for performance improvement of high-efficiency vertical blue light-emitting diodes by InGaN/GaN superlattices

Zhijue Quan; Junlin Liu; Fang Fang; Guangxu Wang; Fengyi Jiang

The effect of InGaN/GaN superlattices(SLs) on quantum efficiency and forward voltage of vertical blue InGaN/GaN multiple quantum well(MQW)light-emitting diodes(LED) grown on Si substrate has been experimentally and theoretically investigated. We have prepared two LED samples, in which the 30 and 45 periods of SLs are inserted between MQW active layers and n-GaN layer, respectively. Electroluminescence measurement shows that the LED with 45 periods of SLs has higher quantum efficiency but lower forward voltage. It is observed that V-shaped pits grow up in size with an increase in SLs period number by means of scan transmission electron microscope and secondary ion mass spectrometry. Further numerical simulations confirm that the performance improvement of LED by SLs is mainly ascribed to enhancing hole injection from the V-shaped pits.


Semiconductor Science and Technology | 2015

Temperature-dependent electroluminescence from InGaN/GaN green light-emitting diodes on silicon with different quantum-well structures

Guangxu Wang; Xixia Tao; Junlin Liu; Fengyi Jiang

Temperature-dependent electroluminescence from InGaN/GaN light-emitting diodes (LEDs) grown on Si (111) are investigated. With the increase of current density, internal quantum efficiencies (IQEs) firstly rise accompanied by full width at half maximum (FWHM) shrinkage and then IQEs droop combined with FWHM broadening are presented. With the decline of temperature, both the maximum of IQEs accompanying the minimum of FWHM shift towards the direction of low current density. Moreover, the maximum of IQEs shift faster than the minimum of FWHM for single quantum well LED. Furthermore, it was found that the quantum well close to n-GaN has priority to radiate in small current injection, especially at low temperature (100 K) for multiple quantum wells LED.

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