Frank J. Poradish

Modular ICNIA Packaging Technology

Significant size, weight, power and reliability improvements can be achieved in next generation avionics by the modular integration of similar functions into a fault tolerant reconfigurable architecture. The Integrated Communication Navigation Identification Avionics program (ICNIA), and ITT/TI Joint Venture, is accomplishing this task with a combination of modular circuit designs using VHSIC technology, improved packaging designs incorporating surface mount component technology and a modular two-level maintenance support concept for reduced life cycle cost. This article will concentrate on the modular packaging technology of the digital processor subsystem.