Franz P. G. Fengler

Lanthanum-Doped Hafnium Oxide: A Robust Ferroelectric Material

Recently simulation groups have reported the lanthanide series elements as the dopants that have the strongest effect on the stabilization of the ferroelectric non-centrosymmetric orthorhombic phase in hafnium oxide. This finding confirms experimental results for lanthanum and gadolinium showing the highest remanent polarization values of all hafnia-based ferroelectric films until now. However, no comprehensive overview that links structural properties to the electrical performance of the films in detail is available for lanthanide-doped hafnia. La:HfO2 appears to be a material with a broad window of process parameters, and accordingly, by optimization of the La content in the layer, it is possible to improve the performance of the material significantly. Variations of the La concentration leads to changes in the crystallographic structure in the bulk of the films and at the interfaces to the electrode materials, which impacts the spontaneous polarization, internal bias fields, and with this the field cycling behavior of the capacitor structure. Characterization results are compared to other dopants like Si, Al, and Gd to validate the advantages of the material in applications such as semiconductor memory devices.

Root cause of degradation in novel HfO 2 -based ferroelectric memories

HfO2-based ferroelectrics reveal full scalability and CMOS integratability compared to perovskite-based ferroelectrics that are currently used in non-volatile ferroelectric random access memories (FeRAMs). Up to now, the mechanisms responsible for the decrease of the memory window have not been revealed. Thus, the main scope of this study is an identification of the root causes for the endurance degradation. Utilizing trap density spectroscopy for examining defect evolution with cycling of the device studied together with modeling of the degradation resulted in an understanding of the main mechanisms responsible for degradation of the ferroelectric behavior.

Comparison of hafnia and PZT based ferroelectrics for future non-volatile FRAM applications

Ferroelectric random access memories (FRAM) are nonvolatile memories which allow a fast access time and a low power consumption. State-of-the-art devices are based on the perovskite lead zirconate titanate (PZT), which suffers from CMOS incompatibility resulting in scaling issues. The discovery of the ferroelectricity in doped hafnium oxide enabled scaled 3D memory devices. A variety of dopants has already been found to stabilize the orthorhombic phase, responsible for ferroelectric switching. Interestingly, among the variety of dopants only a mixed hafnium zirconium oxide (HZO) enabled a wide process window together with a large memory window. Here, we compare PZT with HZO and show that despite different dielectric properties similar memory relevant performance can be achieved. Additionally, analogous wake-up and degradation behavior can be observed in both materials. Moreover, we show experimental proof that a thermally driven wake-up in both material systems is caused by diffusion of ionic charges. Extracted activation energy hints to oxygen vacancy movement as the main cause for the wake-up effect in HZO.

On the relationship between field cycling and imprint in ferroelectric Hf0.5Zr0.5O2

Manifold research has been done to understand the detailed mechanisms behind the performance instabilities of ferroelectric capacitors based on hafnia. The wake-up together with the imprint might be the most controversially discussed phenomena so far. Among crystallographic phase change contributions and oxygen vacancy diffusion, electron trapping as the origin has been discussed recently. In this publication, we provide evidence that the imprint is indeed caused by electron trapping into deep states at oxygen vacancies. This impedes the ferroelectric switching and causes a shift of the hysteresis. Moreover, we show that the wake-up mechanism can be caused by a local imprint of the domains in the pristine state by the very same root cause. The various domain orientations together with an electron trapping can cause a constriction of the hysteresis and an internal bias field in the pristine state. Additionally, we show that this local imprint can even cause almost anti-ferroelectric like behavior in ferroelectric films.Manifold research has been done to understand the detailed mechanisms behind the performance instabilities of ferroelectric capacitors based on hafnia. The wake-up together with the imprint might be the most controversially discussed phenomena so far. Among crystallographic phase change contributions and oxygen vacancy diffusion, electron trapping as the origin has been discussed recently. In this publication, we provide evidence that the imprint is indeed caused by electron trapping into deep states at oxygen vacancies. This impedes the ferroelectric switching and causes a shift of the hysteresis. Moreover, we show that the wake-up mechanism can be caused by a local imprint of the domains in the pristine state by the very same root cause. The various domain orientations together with an electron trapping can cause a constriction of the hysteresis and an internal bias field in the pristine state. Additionally, we show that this local imprint can even cause almost anti-ferroelectric like behavior in ferroe...

Comparative study of ITO and TiN fabricated by low-temperature RF biased sputtering

Radio frequency (RF) biasing induced by a second plasma source at the substrate is applied to low-temperature sputtering processes for indium tin oxide (ITO) and titanium nitride (TiN) thin films. Investigations on crystal structure and surface morphology show that RF-biased substrate plasma processes result in a changed growth regime with different grain sizes and orientations than those produced by processes without a substrate bias. The influence of the RF bias is shown comparatively for reactive RF-sputtered ITO and reactive direct-current-sputtered TiN. The ITO layers exhibit an improved electrical resistivity of 0.5 mΩ cm and an optical absorption coefficient of 0.5 × 104 cm−1 without substrate heating. Room-temperature sputtered TiN layers are deposited that possess a resistivity (0.1 mΩ cm) of 3 orders of magnitude lower than, and a density (5.4 g/cm3) up to 45% greater than, those obtained from layers grown using the standard process without a substrate plasma.