G. Boyd

The ATLAS Silicon Pixel Sensors

Prototype sensors for the ATLAS silicon pixel detector have been developed. The design of the sensors is guided by the need to operate them in the severe LHC radiation environment at up to several hundred volts while maintaining a good signal-to-noise ratio, small cell size, and minimal multiple scattering. The ability to be operated under full bias for electrical characterization prior to attachment of the readout integrated circuit electronics is also desired.

A measurement of Lorentz angle and spatial resolution of radiation hard silicon pixel sensors

Silicon pixel sensors developed by the ATLAS collaboration to meet LHC requirements and to withstand hadronic irradiation to fluences of up to

Electrical characteristics of silicon pixel detectors

10^{15} n_eq/cm^{2}

Flex circuits for the ATLAS pixel detector

have been evaluated using a test beam facility at CERN providing a magnetic field. The Lorentz angle was measured and found to alter from 9.0 deg. before irradiation, when the detectors operated at 150 V bias at B=1.48 T, to 3.1 deg after irradiation and operating at 600 V bias at 1.01 T. In addition to the effect due to magnetic field variation, this change is explained by the variation of the electric field inside the detectors arising from the different bias conditions. The depletion depths of irradiated sensors at various bias voltages were also measured. At 600 V bias 280 micron thick sensors depleted to ~200 micron after irradiation at the design fluence of 1 10^{15} 1 MeV n_eq/cm2 and were almost fully depleted at a fluence of 0.5 * 10^{15} 1 MeV n_eq/cm2. The spatial resolution was measured for angles of incidence between 0 deg and 30 deg. The optimal value was found to be better than 5.3 micron before irradiation and 7.4 micron after irradiation.

Design and initial performance of the CLEO III silicon tracker

Prototype sensors for the ATLAS silicon pixel detector have been electrically characterized. The current and voltage characteristics, charge-collection efficiencies, and resolutions have been examined. Devices were fabricated on oxygenated and standard detector-grade silicon wafers. Results from prototypes which examine p-stop and standard and moderated p-spray isolation are presented for a variety of geometrical options. Some of the comparisons relate unirradiated sensors with those that have received fluences relevant to LHC operation.

The hardware of the ATLAS Pixel Detector Control System

Abstract Recent progress on designs of flexible circuits for the ATLAS pixel detector will be discussed. Thin flexible circuits can be used to provide power and signal connections between front-end (FE) readout chips and data acquisition chips on the pixel detector module. Fabrication of a prototype design has been completed and test beam measurements with a 16 FE chip flex module gave an efficiency of 98.4% and a position resolution of 13.8 μm for clusters consisting of one or two pixels.

The CLEO III silicon vertex detector

Abstract CLEO III is the new experimental phase of the CLEO experiment at the CESR accelerator. Both the accelerator and the detector have recently been upgraded. A new charged particle tracking system with the addition of a ring imaging Cherenkov particle identification system has been installed. A major part of the tracking system upgrade was the construction of a new four-layer double-sided silicon tracker with 93% solid angle coverage and new readout electronics. The CLEO III upgrade was completed in February 2000 with the installation of the silicon detector. CLEO III has finished the commissioning phase and is now taking data. The design of the detector and first performance results are presented here.

Status of the CLEO III silicon tracker

The innermost part of the ATLAS (A Toroidal LHC ApparatuS) experiment, which is currently under construction at the LHC (Large Hadron Collider), will be a silicon pixel detector comprised of 1744 individual detector modules. To operate these modules, the readout electronics, and other detector components, a complex power supply and control system is necessary. The specific powering and control requirements, as well as the custom made components of our power supply and control systems, are described. These include remotely programmable regulator stations, the power supply system for the optical transceivers, several monitoring units, and the Interlock System. In total, this comprises the Pixel Detector Control System (DCS).