G. Vanko

AlGaN/GaN high electron mobility transistors with nickel oxide based gates formed by high temperature oxidation

We report on the design of gates of AlGaN/GaN high electron mobility transistors (HEMTs) to be predetermined for high temperature applications. In this design, nickel oxide (NiO) gate interfacial layer is formed by high temperature oxidation (T = 500–800 °C, for 1 min) of 15 nm thick Ni gate contact layer to provide a high temperature stable gate interface. AlGaN/GaN HEMTs with thermic NiO gate contact layer show excellent dc performance with higher peak transconductance, larger gate voltage swing, higher linearity, and thermal stability as compared to the reference device based on Ni gate contact layer.

AlGaN/GaN diaphragm-based pressure sensor with direct high performance piezoelectric transduction mechanism

The piezoelectric response of AlGaN/GaN circular HEMT pressure sensing device integrated on AlGaN/GaN diaphragm was experimentally investigated and supported by the finite element method modeling. The 4.2 μm thick diaphragm with 1500 μm diameter was loaded by the dynamic peak-to-peak pressure up to 36 kPa at various frequencies. The piezoelectric charge induced on two Schottky gate electrodes of different areas was measured. The frequency independent maximal sensitivity 4.4 pC/kPa of the piezoelectric pressure sensor proposed in a concept of micro-electro-mechanical system was obtained on the gate electrode with larger area. The measurement revealed a linear high performance piezoelectric response in the examined dynamic pressure range.

GaAs and GaN based SAW chemical sensors: acoustic part design and technology

In this paper, we present the design considerations and the technology process of SAW (surface acoustic wave) chemical sensors based either on GaAs or GaN structures. These sensors can be used for identifying environmental contaminants and chemical or biological agents in large applications scale; in this study, we aimed at the measurement of low concentrations of gaseous mercury. We describe the design of the acoustic part of the sensor including the structure for the generation and reception of the surface acoustic wave and the chemoselective coating made of gold. We show the technology process that achieves the device operating at the frequency of 250 MHz. Finally we present some preliminary results obtained from the device

Characterization of epitaxial 4H-SiC for photon detectors

High purity epitaxial 4H-SiC became a serious candidate for the fabrication of spectrometric radiation detectors with a high resistance to neutrons and gamma rays damage and suitable for applications in hot plasma diagnostics. The present work reports on i) the characterization of high purity epitaxial 4H-SiC grown by liquid phase epitaxy on SiC substrates and ii) the performances of metal/4H-SiC detectors fabricated on the same material. X-ray diffraction and topography as well as I-V, C-V and DLTS measurements are used for the evaluation of the material properties and device characteristics. The UV and X-ray detection abilities are evaluated by photocurrent measurements in the 3-6 eV region and pulse-height spectra measurements of the 241Am, respectively. Preliminary results of the detector hardness to fast neutron and gamma ray radiations are also reported.

Stress investigation of the AlGaN/GaN micromachined circular diaphragms of a pressure sensor

In this paper, selected mechanical properties of a circular AlGaN/GaN diaphragm with an integrated circular high electron mobility transistor (HEMT) intended for pressure sensing are investigated. Two independent methods were used to determine the residual stress in the proposed diaphragms. The resonant frequency method using laser Doppler vibrometry (LDV) for vibration measurement was chosen to measure the natural frequencies while the diaphragms were excited by acoustic impulse. It is shown that resonant frequency is strongly dependent on the built-in residual stress. The finite element analysis (FEM) in Ansys software was performed to determine the stress value from frequency spectra measured. The transition behavior of proposed diaphragms between the ideal circular membrane and plate is observed and discussed. Secondly, the bulging method and white light interferometry (WLI) are used to determine the stress-dependent deflection response of the AlGaN/GaN diaphragm under static pressure loading. Regarding the results obtained, the optimal design of the sensing electrodes is outlined.

Ohmic contacts to p-GaN Using Au/Ni-Mg-O Metallization

Ohmic contacts to p-GaN Using Au/Ni-Mg-O Metallization Electrical characteristics and elemental depth profiles of ohmic contacts to p-GaN using Au/Ni-Mg-Ox metallization have been investigated. The objective was to examine the possibilities of increasing the charge carrier concentration in the surface region of GaN by adding Mg, thus of a p-type dopant into the Au/NiOx metallization structure. For this purpose, a Ni-Mg-Ox layer with a low concentration of Mg was deposited on p-GaN by dc reactive magnetron sputtering. The top Au layer was deposited in a similar way. The fabricated contact structures were annealed in N2. When the Ni-Mg layer in the Au/Ni-Mg-Ox/p-GaN structure was deposited in an atmosphere with a low concentration of oxygen (0.2 at%), the structure exhibited a low resistance ohmic nature. The contact resistance was lower than in the case of a Au/Ni-Ox/p-GaN structure without the Mg dopant in the metallic layer. An increase in the concentration of oxygen in the working atmosphere resulted in higher values of the contact resistance of the Au/Ni-Mg-Ox/p-GaN structure. In our opinion the ohmic nature of the contact structure is related to the existence of a metal/p-NiO/p-GaN scheme. The measured values of the contact resistance in the Au/Ni-Mg-Ox/p-GaN structure in comparison with the Au/Ni-Ox/p-GaN structure are caused by an increased charge carrier concentration in the surface region of p-GaN, which is a consequence of Mg diffusion from the Ni-Mg-Ox layer.

Influence of Diamond CVD Growth Conditions and Interlayer Material on Diamond/GaN Interface

In this study we present the diamond deposition on AlGaN/GaN substrates focusing on the quality of the diamond/GaN interface. The growth of diamond films was performed using microwave chemical vapour deposition system in different gas mixtures: standard CH4/H2 (at low and high ratio of CH4 to H2) and addition of CO2 to CH4/H2 gas chemistry. The diamond films were grown directly on GaN films either without or with thin interlayer. As interlayer, 100 nm thick Si3N4 was used. Surprisingly, in the case of standard CH4/H2 gas mixture, no diamond film was observed on the GaN with SiN interlayer, while adding of CO2 resulted in diamond film formation of both samples with and without SiN interlayer. Moreover, adding of CO2 led to higher growth rate. The morphology of diamond films and the quality of the diamond/GaN interface was investigated from the cross-section images by scanning electron microscopy and the chemical character (i.e. sp3 versus sp2 carbon bonds) was measured by Raman spectroscopy.

Modal Analysis of Gallium Nitride Membrane for Pressure Sensing Device

A circular high electron mobility transistor (C-HEMT) prepared on the AlGaN/GaN membrane surface has been investigated and its potential for pressure sensing has been already demonstrated. The key issue in the design process of such heterostructure based MEMS sensors is the stress engineering. This way we can scale the sensor performance, measured pressure range and sensitivity. Especially, the knowledge of the exact value of the residual stress in membranes (caused by deposition process) helps us to optimize the sensing devices. In this work, the residual stress determination method in gallium nitride circular shaped membrane is reported. It is shown that resonant frequency method using Laser Doppler Vibrometry (LDV) for membrane vibration measurement seems to be an appropriate technique to determine the residual stress in micro-scale membranes. Circularly shaped AlGaN/GaN micro-membranes are excited by acoustic short time pulse. The decay oscillating motion of the membrane is recorded by oscilloscope. By FFT spectral analysis of the signals the resonance frequencies are obtained. For the sample studied, the natural frequency mode resonance peak is used to define the residual stress level. To verify the observed stress in investigated membranes, prestressed modal analysis in finite element method (FEM) code ANSYS is performed. The stress extracted from the measured frequency is taken as an initial stress state of the modelled membrane. Experimentally obtained shock spectra are compared with that computed by FEM simulation.

High Frequency Characterization and Properties of AlGaN/GaN HEMT Structures

The paper reports microwave properties of AlGaN/GaN HEMT fabricated on sapphire substrate. The measured transition frequency as well as maximum frequency of oscillation was taken as a figure of merit for comparison of influence of different treatment. Using 2 mum length of gate electrode 7.425 GHz transition frequency as well as 23.437 GHz maximum frequency of oscillation was achieved. Significant influence of surface plasma treatment on HEMT microwave properties was found.

Influence of temperature on the sensitivity of the AlGaN/GaN C-HEMT-based piezoelectric pressure sensor

We present a finite element method (FEM) analysis of the AlGaN/GaN diaphragm-based pressure sensor with integrated C-HEMT. Our concept uses the C-HEMT as a vertical ring gate capacitor to sense the changes in the piezoelectric charge generated while pressure loading. The lattice mismatch and different thermal expansion coefficients in manufacturing process put the diaphragm to the tension. The operating conditions, especially the elevated temperature, may cause the mechanical stress variations and therefore also the change in mechanical behavior of the pressure sensing diaphragm. Therefore we performed the FEM simulation to predict the influence of elevated temperature and to determine the operating temperature range of proposed circular diaphragm-based MEMS pressure sensor.