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Dive into the research topics where Gary E. Oberlin is active.

Publication


Featured researches published by Gary E. Oberlin.


Archive | 2006

Fluid cooled electronic assembly

Darrel E. Peugh; Bruce A. Myers; Gary E. Oberlin


Archive | 1999

Flip chip with backside electrical contact and assembly and method therefor

Mark A. Koors; Robert Vajagich; Charles I. Delheimer; Scott D. Brandenburg; Gary E. Oberlin


Archive | 2004

Thermally enhanced electronic module with self-aligning heat sink

Suresh K. Chengalva; Gary E. Oberlin; Matthew R. Walsh


Archive | 2007

Method of producing an overmolded electronic module with a flexible circuit pigtail

Scott D. Brandenburg; David A. Laudick; Gary E. Oberlin


Archive | 2003

Power electronic system with passive cooling

Gary E. Oberlin; Bruce A. Myers; Thomas A. Degenkolb; Darrel E. Peugh


Archive | 2004

Multi-path bar bond connector for an integrated circuit assembly

Gary E. Oberlin; Todd P. Oman


Archive | 2003

Integrated circuit assembly with bar bond attachment

Scott D. Brandenburg; Robert Vajagich; Gary E. Oberlin


Archive | 2001

Frontal impact characterization apparatus for a motor vehicle restraint system

Morgan D. Murphy; Douglas A. Nunan; Charles A. Cluff; David R. Little; Greston T. McCoy; Gary E. Oberlin


Archive | 2005

Microelectronic assembly having variable thickness solder joint

Ronnie Joe Runyon; Joanna Christine Berndt; Gary E. Oberlin


Archive | 2007

Flüssigkeitsgekühlte elektronische Anordnung

Darrel E. Peugh; Bruce A. Myers; Gary E. Oberlin

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