Gary Morgan Lucas

Radiation Curable Conductive Ink

A radiation curable, screen printable conductive ink has been developed for use on thermoplastic circuit boards. The fast application and cure of this solventless material allow mass production of low cost circuits suitable for use with systems that can tolerate higher resistance. In one application, a photoflash array, Flipflash, utilizes a piezoelectric crystal to provide the high voltage necessary to overcome the resistance of the system. The conductive medium in this ink was identified from a wide range of available materials. It allows a rapid radiation cure of the binder which provides excellent adhesion and circuit stability.

Inhibition of chloride induced destruction of silver coated glass bead conductive circuits

Conductive circuits formulated from silver coated glass beads and a binder resin occasionally fail when exposed to moderate heat and high humidity in a test simulating a tropical climate. The failure appears as a dark area on the circuit where the silver has been converted to a non-conducting form. We have identified one cause of this failure.

Radiation curable conductive ink

General Electric has developed a photoflash array with many new features of technological interest. These include a new piezo-electric high voltage ignition system, a new lamp design with no filament, a radiation triggered switch, and a novel, low cost circuit board.