Gil Sang Yoon

An Optimal Cure Process to Minimize Residual Void and Optical Birefringence for a LED Silicone Encapsulant

Silicone resin has recently attracted great attention as a high-power Light Emitting Diode (LED) encapsulant material due to its good thermal stability and optical properties. In general, the abrupt curing reaction of the silicone resin for the LED encapsulant during the curing process induces reduction in the mechanical and optical properties of the LED product due to the generation of residual void and moisture, birefringence, and residual stress in the final formation. In order to prevent such an abrupt curing reaction, the reduction of residual void and birefringence of the silicone resin was observed through experimentation by introducing the multi-step cure processes, while the residual stress was calculated by conducting finite element analysis that coupled the heat of cure reaction and cure shrinkage. The results of experiment and analysis showed that it was during the three-step curing process that the residual void, birefringence, and residual stress reduced the most in similar tendency. Through such experimentation and finite element analysis, the study was able to confirm that the optimization of the LED encapsulant packaging process was possible.

Comparison analysis on the properties of the phosphor film according to the various composition ratio of phosphor slurry

The conventional method of making a phosphor layer on the LED package by using a dispensing method is difficult to implement the specific color coordinate, color temperature and optical efficiency because the thickness of the phosphor layer is non-uniform due to precipitation of the phosphor. Besides, the dispensing method consume a large amount of phosphor and silicone to fill the LED package. Thus, studies that manufacture phosphor layer with a uniform thickness such as spray coating, screen printing, electrophoresis are active recently. The purpose of this study is to perform the basic research about the change of the characteristics of phosphor film that is molded with uniform thickness using the phosphor slurry according to various silicone resin and phosphor composition ratio. It is expected to be used as useful information for the fabricating properties when production environment of phosphor layer is changed dispensing method into phosphor film fabrication. In the experiment, it was selected three...

Simulation-Based Optimization of Cure Cycle of Large Area Compression Molding for LED Silicone Lens

Three-dimensional heat transfer-curing simulation was performed for the curing process by introducing a large area compression molding for simultaneous forming and mass production for the lens and encapsulants in the LED molding process. A dynamic cure kinetics model for the silicone resin was adopted and cure model and analysis result were validated and compared through a temperature measurement experiment for cylinder geometry with cure model. The temperature deviation between each lens cavity could be reduced by implementing a simulation model on the large area compression mold and by optimizing the location of heat source. A two-step cure cycle was constructed to reduce excessive reaction peak at the initial stage and cycle time. An optimum cure cycle that could reduce cycle time by more than 29% compared to a one-step cure cycle by adjusting dwell temperature, heating rate, and dwell time was proposed. It was thus confirmed that an optimization of large area LED lens molding process was possible by using the present experiment and the finite element method.

A Study on Tool Deflection Trend Using Real Captured Images in Micro Endmilling Process

Recently, ultra-precision micro patterns and shapes have been widely used in optical field. Various methods which are based on semi-conductor fabrication methods are nowadays used in fabrication of micro shapes and patterns, but micro endmilling technology has lately attracted considerable attention because of various available materials, flexibility of process and high-productivity. For the precision micro endmilling process, analysis of micro cutting error is mandatory. In general, tool deflection is a major factor which causes cutting error and limits realization of the high-precision cutting process. Specially, in micro endmilling process, micro tool deflection generates very serious problems compared to macro tool deflection. In this paper, it is performed to observe the real tool deflection shapes in micro endmilling process, so the trend of micro tool deflection was analyzed using real captured images in this study. To get the real images of micro tool deflection, micro slot cutting processes were executed under various cutting conditions using micro endmill and the real images of tool deflection were obtained during cutting process by high-speed camera. Finally, the extent of tool deflection was calculated by the deflection angle according to cutting conditions and two trends (the point of first tool contact and the cutting stage) of micro tool deflection were analyzed.

Manufacturing of Mold Insert with Micro Fluidic Channel Using Micro Cutting Process

Recently the polymeric LOC (lab-on-a-chip) has been developed by the bio technology and the micro electro mechanical system technology. It is possible that biological experiment and analysis is executed rapidly and easily using a simple specimen. Therefore, many researches on LOC are progressing actively in various fields such as medical, biotechnical, environmental aspects etc. Up to the present time, most of polymeric LOC has been manufactured by LIGA (lithograpie galvanofomung abformung) or chemical etching processes. However, these methods have several disadvantages which are the complicated fabrication stages, requirements for various special equipments and limitations of materials. In this study, in order to overcome these difficulties, the possibilities of micro fluidic channel features were executed by micro cutting process for the steel. So the micro mold insert with micro fluidic channel was designed and manufactured by micro cutting process for the injection molding.

A Study on Mechanical Characteristics of Phosphor Film Containing Methyl Silicone Resin Based on Crosslinking Reaction Analysis

This study reveals a methodological research for predicting mechanical properties of phosphor films through the chemical crosslinking reaction of methyl silicone resin during fabrication of the phosphor films. Crosslinking point according to the type of methyl silicone resins was verified through the magnitude of the absorption peak of the functional group and the curing reaction heat. Then, we measured mechanical properties of the fabricated phosphor films. As a result, it was figured out that the number of the crosslinking point was directly proportional to the total curing reaction heat, and also affected the mechanical properties of the phosphor films. Based on the correlation of curing reaction heat and crosslinking point of the methyl silicone resins and mechanical properties of the fabricated phosphor films, we proposed a methodology that can understand and control the phosphor films in advance of finishing the fabrication of the final phosphor products.

Development of Web-Based Platform System for Sharing Manufacturing Technologies on Housing Parts of Mobile Products

Despite rapid changes in the structure of industry, manufacturing remains a key industry for economic progress, promotion of trade, increased employment, and the creation of new industries. Production technologies are essential for strengthening the competitiveness of small- and medium-sized manufacturing industries. However, it is very difficult to standardize and systematically propagate production technology from an experienced worker to an inexperienced worker because these technologies are generally improved by the skilled people in a workshop. In this study, we introduce a Web-based platform system consisting of a knowledge authoring tool, technology database, semantic database, and Web portal service for sharing production technologies for the exterior housing parts of mobile products. By investigating various cellular phone designs, reference form factors for three types of mobile phone housings were designed based on the standard features. In addition, several manufacturing technologies and considerable information such as reference mold designs and molding conditions optimized using CAE and recent R&D outputs are stored in this system.