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Dive into the research topics where Gilbert De Mey is active.

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Featured researches published by Gilbert De Mey.


Microelectronics Reliability | 2006

Measurements and simulations of transient characteristics of heat pipes

Jaroslaw Legierski; Boguslaw Wiecek; Gilbert De Mey

The rejection of heat generated by components and circuits is a very important aspect in design of electronics systems. Heat pipes are very effective, low cost elements, which can be used in cooling systems. This paper presents the modelling and measurements of the heat and mass transfer in heat pipes. The physical model includes the effects of liquid evaporation and condensation inside the heat pipe. The internal vapour flow was fully simulated using computational fluid dynamics. The theory has been compared with experimental measurements using thermographic camera and contact thermometers. The main purpose of this study is to determine the effective heat pipe thermal conductivity in transient state during start up the pipe operation and temperature increase.


Microelectronics Journal | 2007

Thermal analysis of layered electronic circuits with Green's functions

Marcin Janicki; Gilbert De Mey; Andrzej Napieralski

This paper presents a method for thermal simulation of electronic circuits using an analytical solution of the three-dimensional heat equation resulting from an appropriate circuit thermal model. The temperature fields in multilayered structures are computed analytically employing the Greens functions solution method. The entire solution methodology is illustrated in detail on the particular examples of electronic circuits containing multiple heat sources. Compared to the previous papers published by the authors, the method has been extended by including the possibility of simulating imperfect layer contacts. The simulation results are validated with infra-red measurements and results obtained using other methods. Additionally, the discussion of simulation errors caused mainly by different non-linear phenomena is included.


Textile Research Journal | 2014

Discharge characteristics of poly(3,4-ethylene dioxythiophene): poly(styrenesulfonate) (PEDOT:PSS) textile batteries; comparison of silver coated yarn electrode devices and pure stainless steel filament yarn electrode devices

Sheilla Atieno Odhiambo; Gilbert De Mey; Carla Hertleer; Anne Schwarz; Lieva Van Langenhove

This paper investigates textile-based energy storage devices fabricated with poly(3,4-ethylene dioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) as an electro-active polymer and conductive yarns as the electrodes. The conductive yarns are sewn into a textile substrate and then coated with PEDOT:PSS systematically. Two different sets of devices were made. A comparison of the devices made with silver coated polybenzoxazol filament yarns and the devices made with pure stainless steel filament yarns is performed. The devices were charged and their self-discharge was measured by voltage decay. A study of the influence of charging time on the decay and the effect brought by various load resistors on the voltage decay is also performed. In this research, the devices with electrodes of pure stainless steel filaments yarns performed better than the devices with silver coated yarns; this outcome has been reported as standard by various researchers.


Microelectronics Reliability | 2002

Transient thermal analysis of multilayered structures using Green's functions

Marcin Janicki; Gilbert De Mey; Andrzej Napieralski

Abstract This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analytical time dependent solutions are determined for multilayered structures with the help of Greens functions (GFs). The GFs required for the solution are found using a Galerkin-based integral method. The entire solution method is illustrated in detail using a practical example, where the results of transient thermal simulations of a real hybrid power module are compared with infrared measurements.


Textile Research Journal | 2011

Van Der Pauw method for measuring resistivities of anisotropic layers printed on textile substrates

Ilda Kazani; Gilbert De Mey; Carla Hertleer; Jedrzej Banaszczyk; Anne Schwarz; Genti Guxho; Lieva Van Langenhove

Electrically conducting layers have been screen printed on woven textile substrates. Using the Van Der Pauw method for electrical resistivity measurements in thin layers, it was observed that the screen-printed layers showed anisotropic behavior. In order to be able to interpret the measurements correctly, a mathematical analysis of the measuring method has been established. From the experimental results one is then able to find the relation between the electrical resistivity in the warp versus the weft direction.


Textile Research Journal | 2012

A study on the morphology of thin copper films on para-aramid yarns and their influence on the yarn’s electro-conductive and mechanical properties

Anne Schwarz; Jean Hakuzimana; Philippe Westbroek; Gilbert De Mey; Georgios Priniotakis; Tebello Nyokong; Lieva Van Langenhove

The latest technological advances in new materials and devices enabled wearable systems to be created by utilizing textile solutions. These solutions require electro-conductive yarns as a basic component. Although the production of electro-conductive yarn is widely reported, research is still necessary to characterize them to advance their electro-conductive and mechanical properties. Hence, we served this need and characterized copper-coated para-aramid yarns produced by an in-house developed electroless deposition method. In this paper we present our investigation on the yarn’s copper layer characteristics after deposition. Furthermore, we looked, in depth, at the yarn’s electro-conductive properties before and after washing as well as their mechanical properties before and after copper deposition. We found a dependency of the copper layer morphology on its deposition time. This is directly correlated to the resulting layer thickness and hence to the yarn’s electro-conductive properties, demonstrating the autocatalytic nature of the coating process. Above that, the electro-conductive properties of the coated yarn linearly decrease with washing cycles. Furthermore, the copper coating impairs the yarn’s mechanical properties decreasing its specific stress at break by 30%.


Microelectronics Journal | 2002

Application of Green's functions for analysis of transient thermal states in electronic circuits

Marcin Janicki; Gilbert De Mey; Andrzej Napieralski

This paper presents an approach to the modelling of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analytical time dependent solutions are determined with the help of Greens functions. The solution method is illustrated in detail on a practical example, where the results of transient thermal simulations of a real hybrid circuit are compared with infrared measurements.


Energy Conversion and Management | 1998

Optimization of the master–slave inverter system for grid–connected photovoltaic plants

Witold Marańda; Gilbert De Mey; Alexis De Vos

Use of the DC/AC inverter is a necessity for a majority of small residential PV-systems. Apart from the efforts of making the devices more efficient, their proper choice and configuration may further improve the performance of the PV-system. This paper presents the idea for optimization of a master–slave inverter by setting the Pon and Poff parameters. The method is illustrated by results from the PV-system in Melle, in Belgium.


Microelectronics Reliability | 2011

Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses

Marcin Janicki; Jedrzej Banaszczyk; B. Vermeersch; Gilbert De Mey; Andrzej Napieralski

This paper concerns the problem of generating reduced dynamic thermal models whose elements have physical interpretation. The compact models of an electronic system are generated here based on the analysis of the time constant spectra of system transient thermal responses. The proposed method is illustrated on a practical example of an integrated power amplifier with a heat sink. The experiments demonstrate the influence of contact resistance and cooling conditions on the resulting values of thermal model elements.


Microelectronics Reliability | 2004

Staggered heat sinks with aerodynamic cooling fins

O Leon; Gilbert De Mey; Erik Dick; Jan Vierendeels

Abstract The effect of aerodynamic shaping of the cooling fins in staggered heat sinks is numerically studied. It is shown that by rounding the cooling fins, the aerodynamic efficiency is increased without affecting the thermal efficiency. Three different geometries (in-line rectangular, staggered rectangular and rounded staggered shape) have been compared. These three different layouts were studied to obtain the best ratio between the removed heat and the energy spent to drive the coolant flow through the cooling fins. The main purpose of the paper is to determine the influence of the rounded shape on the average performance. As an example, it was found that a rounded staggered fin layout removes the same heat for an incident air velocity of 4 m/s as a classical in-line fin layout with a higher air speed of 6 m/s, with a reduction of fan power consumption by more than 60%.

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Andrzej Napieralski

Lodz University of Technology

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Genti Guxho

Polytechnic University of Tirana

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