Go Hiroshi | Researchain

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Archive | 1990

COOLING STRUCTURE FOR ELECTRONIC APPARATUS

Miyamoto Mitsuo; Zushi Shizuo; Hayashi Isataka; Mori Toshio; Go Hiroshi

Archive | 1993

APPARATUS INCLUDING REFRIGERATORY STRUCTURE HAVING SLIDING PORTION AND COMPOUND TO BE USED THEREFOR

Uematsu Toyohito; Shoji Saburo; Nakakawaji Takayuki; Komatsuzaki Shigeki; Ito Yutaka; Morihara Atsushi; Sato Yasushi; Zushi Shizuo; Go Hiroshi

Archive | 1992

MOUNTING STRUCTURE OF HEAT SINK IN ELECTRONIC DEVICE

Go Hiroshi; Miyamoto Mitsuo; Mori Toshio; Zushi Shizuo

Archive | 1997

Elektrisches Gerät enthaltend ein Schmiermittel oder eine wärmeleitende Zusammensetzung.

Uematsu Takao; Shoji Mitsuyoshi; Nakakawaji Takayuki; Komatsuzaki Shigeki; Ito Yutaka; Morihara Atsushi; Sato Koji; Zushi Shizuo; Go Hiroshi

Archive | 1991

PIPING STRUCTURE OF ELECTRONIC DEVICE

Go Hiroshi; Zushi Shizuo; Miyamoto Mitsuo

Archive | 1990

COOLING MECHANISM FOR ELECTRONIC DEVICE AND USAGE THEREOF

Go Hiroshi; Zushi Shizuo; Miyamoto Mitsuo

Archive | 1989

Package cooling method

Morihara Atsushi; Naganuma Yoshio; Yokoyama Hiroshi; Kawamura Keizo; Miyamoto Mitsuo; Sato Yasushi; Ouchi Kazunori; Miyadera Hiroshi; Kobayashi Fumiyuki; Zushi Shizuo; Go Hiroshi

Archive | 1992

FLUORINE-CONTAINING SURFACE-MODIFYING MATERIAL, HEAT-TRANSMISSION MATERIAL PRODUCED BY USING THE MATERIAL AND MODULE FOR MOUNTING SEMICONDUCTOR

Shoji Saburo; Nakakawaji Takayuki; Uematsu Toyohito; Ito Yutaka; Komatsuzaki Shigeki; Morihara Atsushi; Sato Yasushi; Naganuma Yoshio; Go Hiroshi; Zushi Shizuo

Archive | 2001