Gong Chunzhi
Harbin Institute of Technology
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Publication
Featured researches published by Gong Chunzhi.
Rare Metal Materials and Engineering | 2013
Li Chunwei; Tian Xiubo; Liu Tianwei; Qin Jianwei; Yang Jingjing; Gong Chunzhi; Yang Shiqin
Abstract High power pulsed magnetron sputtering (HPPMS) is a novel tool to fabricate films with high quality. In this paper, vanadium films on concave object have been deposited by HPPMS and conventional direct current magnetron sputtering (DCMS) under the condition of the same average power. The plasma composition, crystalline structure, surface morphology and film thickness have been investigated. The results show that the plasma produced by HPPMS is composed of Ar(1+), V(0) and a certain amount of V(1+). In contrast, the plasma produced by DCMS is composed of Ar(1+), V(0) and a very small amount of V(1+). Both films fabricated by HPPMS and DCMS demonstrate the similar microstructures. The HPPMS vanadium films are dense and flat on the top surface while the surface of DCMS vanadium films presents very sharp peak with larger height. The DCMS vanadium films exhibit a porous columnar grain structure. In contrast, the HPPMS vanadium films have slightly columnar and denser structure. The thickness of the HPPMS vanadium films is less than that of DCMS vanadium films. Compared with the surface on the top, the thickness of the DCMS vanadium films is decreased to about 32% at the side wall and to about 55% at the bottom. However, the HPPMS vanadium films can reach a thickness of about 35% at the side wall and 69% at the bottom relative to that on the top surface. HPPMS shows a better uniformity in the film thickness on concave object.
Plasma Science & Technology | 2009
Wei Chunbei; Gong Chunzhi; Tian Xiubo; Yang Shiqin; Ricky K.Y. Fu; Paul K. Chu
Oxygen plasma immersion ion implantation (PIII) has been conducted on AZ31B magnesium alloy using different bias voltages. The modified layer is mainly composed of MgO and some MgAl2O4. Results form Rutherford backscattering spectrometry (RBS) and X-ray photoelectron spectroscopy (XPS) indicate that the bias voltage has a significant impact on the structure of the films. The oxygen implant fluences and the thickness of the implanted layer increase with higher bias voltages. A high bias voltage such as 60 kV leads to an unexpected increments in the oxygen-rich layers thickness compared to those of the samples implanted at 20 kV and 40 kV. The hardness is hardly enhanced by oxygen PIII. The corrosion resistance of magnesium alloy may be improved by a proper implantation voltage.
Plasma Science & Technology | 2010
Jiang Haifu; Gong Chunzhi; Tian Xiubo; Yang Shiqin; R.K.Y. Fu; Paul K. Chu
Titanium nitride (TiN) films were deposited on AISI 304 stainless steel substrates using hollow cathode plasma physical vapor deposition (HC-PVD). Titanium was introduced by eroding the Ti cathode nozzle and TiN was formed in the presence of a nitrogen plasma excited by radio frequency (RF). The substrate bias voltage was varied from 0 to −300 V and the uniformity in film thickness, surface roughness, crystal size, microhardness and wear resistance for the film with a diameter of 20 mm was evaluated. Although the central zone of the plasma had the highest ion density, the film thickness did not vary appreciably across the sample. The results from atomic force microscopy (AFM) revealed a low surface roughness dominated by an island-like morphology with a similar crystal size on the entire surface. Higher microhardness was measured at the central zone of the sample. The sample treated at −200 V had excellent tribological properties and uniformity.
Surface & Coatings Technology | 2013
Wei Yongqiang; Zong Xiaoya; Wu Zhongzhen; Tian Xiubo; Gong Chunzhi; Yang Shiqin; Jiang Zhiqiang; Chen Liangji
Vacuum | 2013
Wei Yongqiang; Chen Xiaoxia; Tian Xiubo; Gong Chunzhi; Yang Shiqin; Jiang Zhiqiang; Chen Liangji
Archive | 2015
Tian Xiubo; Xu Jianping; Gong Chunzhi
Archive | 2015
Tian Xiubo; Wu Mingzhong; Gong Chunzhi
Archive | 2010
Zhang Xin-Meng; Tian Xiubo; Gong Chunzhi; Yang Shiqin
Vacuum | 2017
Ma Yinghe; Gong Chunzhi; Tian Xiubo; K Chu Paul
Journal of Vacuum Science and Technology | 2017
Tian Xiubo; Ma Yinghe; Hu Jian; Bi Mingkang; Gong Chunzhi; K Chu Paul