Gordon Merle Jones

Investigations Regarding the Operating Range of Ultrathin Grinding Wheels on AlTiC

Minimizing the street width, i.e. the distance required for the separation cut between thin-film elements on a wafer, is a key factor for an effective exploitation of a wafer’s area. One potential approach to street width minimization is the use of ultrathin dicing wheels. This paper presents investigations of the operating limits in Al 2 O 3 -TiC wafer dicing with wheels of a width between 16 μ m and 60 μ m Maximum wheel exposure limits for 16 μ m to 40 μ m wheels and feed rate limits for 40 μ m to 60 μ m wheels were identified. The results achieved exceed the established exposure and cut depth ratios by a factor of two.