Guido Schriever

Highly repetitive, extreme-ultraviolet radiation source based on a gas-discharge plasma.

An extreme-ultraviolet (EUV) radiation source near the 13-nm wavelength generated in a small (1.1 J) pinch plasma is presented. The ignition of the plasma occurs in a pseudosparklike electrode geometry, which allows for omitting a switch between the storage capacity and the electrode system and for low inductive coupling of the electrically stored energy to the plasma. Thus energies of only a few joules are sufficient to create current pulses in the range of several kiloamperes, which lead to a compression and a heating of the plasmas to electron densities of more than 10(17) cm(-3) and temperatures of several tens of electron volts, which is necessary for emission in the EUV range. As an example, the emission spectrum of an oxygen plasma in the 11-18-nm range is presented. Transitions of beryllium- and lithium-like oxygen ions can be identified. Current waveform and time-resolved measurements of the EUV emission are discussed. In initial experiments a repetitive operation at nearly 0.2 kHz could be demonstrated. Additionally, the broadband emission of a xenon plasma generated in a 2.2-J discharge is presented.

Sn DPP source-collector modules: status of alpha resources, beta developments, and the scalability to HVM

For industrial EUV (extreme ultra-violet) lithography applications high power extreme ultraviolet (EUV) light sources are needed at a central wavelength of 13.5 nm, targeting 32 nm node and below. Philips Extreme UV GmbH and XTREME technologies GmbH have developed DPP (Discharge Produced Plasma) Alpha tools which run in operation at several locations in the world. In this paper the status of the Alpha Sn-DPP tools as developed by Philips Extreme UV GmbH will be given. The Alpha DPP tools provide a good basis for the development and engineering of the Beta tools and in the future of the HVM tools. The first Beta source has been designed and first light has been produced. Engineering steps will folow to optimize this first generation Beta Sn-DPP source. HVM tools target EUV power levels from 200W to 500W in IF. In this paper we show that the power requried for HVM can be generated with Sn-DPP sources. Based on Alpha Sn-DPP sources we show that repetition frequency and generated EUV pulse energy is scalable up to power levels that match the HVM requirements.

Tin DPP Source Collector Module (SoCoMo): Status of Beta products and HVM developments

For industrial EUV (extreme ultra-violet) lithography applications high power EUV light sources are needed at a central wavelength of 13.5 nm. Philips Extreme UV GmbH, EUVA and XTREME technologies GmbH have jointly developed tin DPP (Discharge Produced Plasma) source systems. This paper focuses in the first part on the results achieved from the Alpha EUV sources in the field. After integration of power upgrades in the past, now the focus is on reliability and uptime of the systems. The second part of this paper deals with the Beta SoCoMo that can be used in the first pre-production scanner tools of the lithography equipment makers. The performance will be shown in terms of power at Intermediate Focus, dose stability and product reliability but also its reachable collector lifetime, the dominant factor for Cost of Operation. In the third part of the paper the developments for the high volume manufacturing (HVM) phase are described. The basic engineering challenges in thermal scaling of the source and in debris mitigation can be proven to be solvable in practice based on the Beta implementation and related modeling calibrated with these designs. Further efficiency improvements required for the HVM phase will also be shown based on experiments. The further HVM roadmap can thus be realized as evolutionary steps from the Beta products.

EUV source power and lifetime: the most critical issues for EUV lithography

Semiconductor chip manufacturers are expecting to use extreme ultraviolet (EUV) lithography for high volume manufacturing of DRAMs and ICs starting by the end of this decade. Among all the technologies and modules which have to be developed EUV sources at 13.5 nm are considered to be the most critical issue. Specifically the required output power of 115 W at the entrance of the illuminator system in combination with the required lifetimes of source components and collector optics make the source technology critical for EUV lithography. The present paper gives an update of the development status of EUV light sources at XTREME technologies, a joint venture of Lambda Physik AG, Goettingen, and Jenoptik LOS GmbH, Jena, Germany. Results on both laser produced plasma (LPP) and gas discharge produced plasma (GDPP), the two major technologies in EUV sources, are given. The LPP EUV sources use xenon-jet target systems and pulsed lasers with 500 W average power at up to 10 kHz developed at XTREME technologies. The maximum conversion efficiency from laser power into EUV in-band power is 1.0 % into 2p solid angle. 2.0 W EUV radiation is generated at 13.5 nm in 2p sr solid angle. The small source volume of < 0.3 mm diameter will allow large collection angles of 5 sr. The intermediate focus power is estimated to 1 W. Collector mirror lifetime tests showed 5 million pulses lifetime without debris mitigation. With debris mitigation in place lifetimes of more than 1 billion pulses are estimated. For the next generation of higher power EUV LPP sources a laser driver has been tested at 1.3 kW average laser power. This will lead to 5 W EUV power in intermediate focus. The GDPP EUV sources use the Z-pinch principle with efficient sliding discharge pre-ionization. Prototype commercial gas discharge sources with an EUV power of 35W in 2p sr were already delivered for integration into EUV microsteppers. These sources are equipped with a debris-filter which results in an optics lifetime exceeding 100 million discharges at 1 kHz repetition frequency. The same lifetime was achieved for the components of the discharge system itself. The progress in the development of high-power discharge sources resulted in an EUV power of 150 W in continuous operation at 4.5 kHz repetition rate by implementation of porous metal cooling technology. The EUV plasma has a FWHM-diameter of 0.5 mm and a FWHM-length of 1.5 mm. The intermediate focus power is calculated to be in the range of 15 W - 20 W, depending somewhat on the transmission of the optical path to the intermediate focus and on the etendue specification. The typical fluctuations of the EUV energy are standard deviation s<5% without any active stabilization. Discharge sources with Sn as emitter were investigated as more efficient alternative to Xenon. Estimates regarding Sn sources reveal the potential of achieving 65 W intermediate focus power by using developed porous metal cooling technology. Improvement of cooling could open the path to 115 W of power for high volume manufacturing using EUV lithography. However, Sn-sources are technologically risky und much less advanced than Xe sources, since fuel-handling and debris mitigation is much more challenging in comparison to Xe-sources. GDPP and LPP sources still compete for the technology of high volume manufacturing sources for EUV lithography. Optimization potential of the etendue of the optical system of EUV scanners will certainly influence any technology decision for HVM sources.

Development of high-power EUV sources for lithography

We report on the experimental status of the development of gas discharge produced plasma EUV sources for lithography based on the Z-pinch concept. The plasma size of approximately 1.3 mm X 1.5 mm has been matched to come close to the requirements resulting from the etendue of the optical system. The spatial stability of the plasma size as well as the plasma center is better than 15 percent standard deviation. The solid angle of emission is 1.8 sr, i.e. +/- 45 deg. The sources can be operated continuously at 1000 Hz repetition frequency and provide an EUV in-band power of 10 W in 1.8 sr. Spectral measurements providing in-band and out-of-band spectral distribution of the source are discussed.

High-power EUV sources for lithography: a comparison of laser-produced plasma and gas-discharge-produced plasma

Next generation semiconductor chip manufacturing using extreme ultraviolet (EUV) lithography requires a brilliant radiation source with output power between 50 W and 120 W in intermediate focus. This is about five to ten times higher power than that of current DUV excimer lasers used in optical lithography. Lifetime and cost of ownership however, need to be comparable to todays technology. In the present paper experimental results of both laser produced plasma and gas discharge produced plasma EUV source development at XTREME technologies - the EUV joint venture of Lambda Physik AG, Goettingen, and Jenoptik LOS GmbH, Jena, Germany - are presented. Source characterization has been performed with calibrated metrology tools for measurement of energy, power, size, spectra and stability of the EUV emission. The laser plasma investigations are performed with a 1st experimental facility comprising a commercial 40 W Nd:YAG laser coupled to a liquid xenon-jet target system, which was developed by XTREME technologies. The EUV in-band power emitted from the 0.25 mm diameter plasma into 2p solid angle is 0.2 W, the conversion efficiency amounts 0.5 percent. Estimated EUV emission parameters using a 500 W laser for plasma generation to be installed in spring 2002 are discussed. The gas discharge EUV sources described here are based on efficient Xenon Z-pinches. In the 3rd prototype generation the plasma pinch size and the available emission angle have been matched to the etendue of the optical system of 2-3 mm2. The solid angle of emission from the pinch of 1.3 mm x 1.5 mm amounts 1.8 sr. The Z-pinch EUV source can be operated continuously at 1000 Hz with an in-band output power of 10 W in 1.8 sr. This corresponds to 4.5 W in intermediate focus, if no spectral purity filter is needed. The power emitted into a solid angle of 2p sr is 35 W. Emission energy stability ranges between 1 percent and 4 percent standard deviation. Spectral, temporal as well as spatial emission characteristics of the discharge source in dependence on the gas discharge geometry have been evaluated. The potentials as well as limits for power scaling of the two technological source concepts are discussed.

Compact Z-pinch EUV source for photolithography

According to Sematech Internationals analysis extreme ultraviolet (EUV) photolithography is one of the most promising approaches for next generation lithography (NGL). The insertion point of NGL is likely at the 50 nm node. To establish EUV lithography all basic technologies have to be developed t material suppliers, source suppliers, coating manufacturers, optics, lens and tool manufacturers, mask houses, pellicle manufacturers and resist suppliers over the next years. To achieve the required throughput in production various concepts of EUV sources are currently under investigation. Here we discuss new results of design studies on gas discharge Z-pinch sources. Form the EUV source 1 W output power at 100 Hz repetition rate could be obtained in continuous operation. Pulse energy stability is 4% (sigma). In burst operation repetition rate of up to 400 Hz is possible with the current design.

Extreme ultraviolet light generation based on laser-produced plasmas (LPP) and gas-discharge-based pinch plasmas: a comparison of different concepts

Extreme ultraviolet (EUV) lithography tools will need a debris free source with a collectable radiation power of about 40 W to fulfill the prerequisites for an economical wafer throughput up to 80 wafer/hour with a wafer size of 300 mm in diameter. Laser produced plasmas and gas discharge based plasmas are under investigation by several working groups as EUV-sources for this purpose. In this paper the achieved results for the different sources are discussed regarding their emission characteristics in comparison to the demands of EUV lithography (EUVL).

Laser-produced plasma versus laser-assisted discharge plasma: physics and technology of extreme ultraviolet lithography light sources

Powerful extreme ultraviolet (EUV) sources at 13.5 nm are a prerequisite for the economical operation of lithography scanners for semi-conductor manufacturing. These sources have been under development for more than 10 years. At the beginning, many source concepts were considered. Compact technologies like dense plasma focus or capillary Z-pinch discharges reached very rapidly fundamental limits as far as power scalability and lifetime were concerned. Other complex technologies-like synchrotrons-eventually dropped out of the race as well, exceeding by far the footprint and cost targets. Over time, the technology solidified toward the two source concepts: on one hand, the discharge produced plasmas (DPP), which eventually led to the development of the current laser-assisted discharge plasma (LDP); on the other hand, the laser-produced plasmas (LPP). All these technologies generate hot and dense plasmas of similar properties, which emit EUV radiations efficiently as a black body radiator or Planck emitter, in a pulsed manner. The plasma generation method, however, is quite different. DPP uses a pulsed high-voltage current discharge to generate plasma heating a gaseous or vaporized material up to temperatures close to 200,000°C. As for LPP, microscopic droplets of molten tin are fired through a vacuum chamber, individually tracked, vaporized by a pre-pulse laser, and eventually irradiated by a pulsed high-power infrared CO2 laser at 50 to 100 kHz, creating a high-temperature tin plasma, which radiates EUV light. In the case of LDP the plasma is generated between two rotating discs. Partially immersed in baths filled with liquid tin, the discs are wetted and covered with a thin layer of liquid tin. A pulsed laser beam focused on one of the discs evaporates a small amount of tin and generates a tin cloud between the two discs. Next a capacitor bank, which is connected to the discs via the liquid tin, discharges and converts the tin cloud into a plasma heated up to 200,000°C as well.

Xenon DPP Source Technologies for EUVL Exposure Tools

The learning gained in previous developments for EUV Micro Exposure and Alpha Tools builds the basis for the EUVL source development at XTREME technologies and Philips EUV. Field data available from operation of these tools are in use for continuous improvements in core technology areas such as plasma generation and forming, component reliability, debris mitigation and optical performance. Results from integration and operation of alpha tool sources are presented in the areas power performance, component lifetime and debris mitigation efficiency. The analysis results and simulation work of the realized EUV source concept are discussed and innovative concepts for component and module improvements are introduced. The technological limit for the Xenon based sources seems to be reached on alpha performance level. Therefore the next EUV source generations are based on Tin to increase the efficiency and full performance of those sources. For the Betatool and HVM source generations a joint development work between XTREME technologies and Philips EUV is introduced. The related work is content of another presentation of this conference.