Is this you? Create Your Porfile
Avatar

Guido Wenski

Hess Corporation

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Guido Wenski is active.

Explore More

Publication

Featured researches published by Guido Wenski.

Archive | 2001

Process for the surface polishing of silicon wafers

Guido Wenski; Thomas Buschhardt; Heinrich Hennhöfer; Bruno Lichtenegger

Archive | 2000

Production of semiconductor wafers comprises simultaneously polishing front and rear sides of each wafer between polishing plates covered with cloth, evaluating and then re-polishing

Guido Wenski; Thomas Buschhardt; Heinrich Hennhoefer; Bruno Lichtenegger

Archive | 2006

Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method

Ruediger Schmolke; Thomas Buschhardt; Gerhard Heier; Guido Wenski

Archive | 2005

Semiconductor wafer processing e.g. lapping, method for assembly of electronic components, involves processing wafer until it is thinner than rotor plate and thicker than layer, with which recess of plate is lined for wafer protection

Thomas Buschhardt; Gerhard Heier; Rüdiger Dr. Dipl.-Phys. Schmolke; Guido Wenski

Archive | 2002

Silicon wafer used in the production of integrated electronic components has a haze-free polished front surface and a polished rear surface

Guido Wenski; Heinrich Hennhoefer; Bruno Lichtenegger; Thomas Buschhardt; Paul Mueller

Archive | 2000

Verfahren zur Oberflächenpolitur von Siliciumscheiben

Guido Wenski; Thomas Buschhardt; Heinrich Hennhoefer; Bruno Lichtenegger

Archive | 2009

Method for machining a semiconductor wafer

Ruediger Schmolke; Thomas Buschhardt; Gerhard Heier; Guido Wenski

Archive | 2001

Process for polishing the surface of a silicon wafer

Thomas Buschhardt; Heinrich Hennhöfer; Bruno Lichtenegger; Guido Wenski

Archive | 2000

Verfahren zur Oberflächenpolitur von Siliciumscheiben A method for surface polishing of silicon wafers

Guido Wenski; Thomas Buschhardt; Heinrich Hennhoefer; Bruno Lichtenegger

Archive | 2000

Verfahren zur Herstellung einer Vielzahl von polierten Halbleiterscheiben A process for producing a plurality of polished semiconductor wafers

Guido Wenski; Thomas Buschhardt; Heinrich Hennhoefer; Bruno Lichtenegger

Explore More

Collaboration

Dive into the Guido Wenski's collaboration.

Top Co-Authors
Avatar

Thomas Buschhardt

Hess Corporation

View shared research outputs
Top Co-Authors
Avatar

Bruno Lichtenegger

Hess Corporation

View shared research outputs
Top Co-Authors
Avatar

Heinrich Hennhöfer

Hess Corporation

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge