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Gundlach Harald

Infineon Technologies

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Publication

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Archive | 2003

Verfahren zur Herstellung einer strukturierten Metallschicht auf einem Trägerkörper und Trägerkörper mit einer strukturierten Metallschicht

Simmerlein-Erlbacher Ewald; Mueller-Hipper Andreas; Gundlach Harald

Archive | 2003

Semiconductor chip has structure for protecting smart cards from spying comprising an integrated circuit to monitor changes in the conductors

Gundlach Harald; Schmid Guenter

Archive | 2006

Gegen Analyse geschütztes Halbleiterbauelement und zugehöriges Herstellungsverfahren

Gundlach Harald; Marbach-Fischbach Ida

Archive | 2003

Chip card or storage card, such as a multimedia card is configured as a TSLP package so that higher production rates can be achieved with lower production costs

Gundlach Harald; Huber Michael

Archive | 2003

Information matrix e.g. for protection of confidential information contained on semiconductor chip, has first conduction structures overlying second conduction structures to form points of intersection

Duebotzky Anja; Gundlach Harald; Stuffer Anton; Lippmann Bernhard; Mayerhofer Boris; Huebner Holger; Marbach Ida

Archive | 2002

Semiconductor element used in a chip card in the pay-per-view television sector comprises a chip, and a device for deactivating the chip consisting of a hollow chamber containing an activator

Gundlach Harald; Marbach Ida

Archive | 2000

Method for producing a strip conductor from a cupriferous metal particle suspension sprays the strip conductor with the suspension using a stencil mask or focussing spray device onto a plastic card body's substrate.

Gundlach Harald; Mueller-Hipper Andreas; Radlik Wolfgang; Schmid Guenter

Archive | 2003

Arrangement of semiconductor chip in chip carrier housing has conductive coating applied to semiconductor chip on opposite side to chip carrier

Schulte-Doeinghaus Bernhard; Geyer Kai; Gundlach Harald

Archive | 2002

Verfahren zur Ausbildung einer an einem Halbleiterchip angebrachten Antenne

Gundlach Harald; Huebner Holger; Mueller-Hipper Andreas; Riedel Jens

Archive | 2002

Chip module that is to be inserted in a chip card body has an intermediate support so that it fits neatly into the card forming a smooth seal with no gaps or slits

Gundlach Harald; Stampka Peter

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Mueller-Hipper Andreas

Infineon Technologies

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Riedel Jens

Infineon Technologies

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Stampka Peter

Infineon Technologies

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Huebner Holger

Infineon Technologies

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Marbach Ida

Infineon Technologies

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Mayerhofer Boris

Infineon Technologies

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Schmid Guenter

Infineon Technologies

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Duebotzky Anja

Infineon Technologies

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Geyer Kai

Infineon Technologies

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Huber Michael

Infineon Technologies

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