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Dive into the research topics where Guo Jingdong is active.

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Featured researches published by Guo Jingdong.


Materials Science and Engineering A-structural Materials Properties Microstructure and Processing | 2002

The effect of high current pulsing on persistent slip bands in fatigued copper single crystals

Xiao Suhong; Zhou Yizhou; Guo Jingdong; Wu Shiding; Yao Ge; Li Shouxin; He Guanhu; Zhou Benlian

Copper single crystals fatigued along [(1) over bar 23] loading axis were treated by high current pulsing after the formation of persistent slip bands (PSBs). The results show that the treatment by electropulsing made the PSBs vanish locally. This is due to the thermal compressive stress induced by electropulsing, which reduced the stress concentration at the interface between PSBs and matrix. The annihilation of edge dislocations reduced the width of PSBs and made the PSBs vanish locally. The main factor that made the dislocations move was the thermal compressive stress. The velocity of the dislocation motion is about (10(3)-10(2)) cm s(-1)


Acta Metallurgica Sinica | 1997

THE INFLUENCE OF PULSE ELECTRIC DISCHARGING ON SOLIDIFIED STRUCTURE OF Sn-10% Pb ALLOY

Yan Hongchun; He Guanhu; Zhou Benlian; Qin Rongshan; Guo Jingdong; Shenyang Manuscript received ; in revised form


Archive | 2002

Resistance welding method for non-crystal Zr-base blocks

Zhou Yizhou; Guo Jingdong; Wang Baoquan


Archive | 2013

Apparatus for testing multi-field service characteristic of microelectronic product

Cui Xueshun; Guo Jingdong; Zhu Qingxing; Liu Zhiquan; Wu Di; Zhang Lei; Cao Lihua


Archive | 2015

Controllable preparation method of tin and indium interconnection welding spot IMCs ( intermetallic compounds)

Liu Zhiquan; Tian Feifei; Shang Panju; Guo Jingdong


Archive | 2004

Automatic drip irrigation flow rate control switch

Zeng You; Guo Jingdong; He Guanhu


Archive | 2001

Resistance welding method of fine-grain metal material

Zhou Yizhou; Guo Jingdong; He Guanhu


Archive | 2014

Microelectronic product reliability test method under force electrothermal multi-field coupling

Guo Jingdong; Zhu Qingxing; Liu Zhiquan; Cui Xueshun; Wu Di; Zhang Lei; Cao Lihua


Archive | 2014

Microelectronic product reliability test platform under force electrothermal multi-field coupling effect

Cui Xueshun; Guo Jingdong; Zhu Qingxing; Liu Zhiquan; Wu Di; Zhang Lei; Cao Lihua


Archive | 2014

Cylindrical salient-point packaging structure having FeNi alloy or FeNiP alloy-based reaction interface layer

Liu Zhiquan; Guo Jingdong; Zhu Qingxing; Cao Lihua

Collaboration


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Liu Zhiquan

Chinese Academy of Sciences

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He Guanhu

Chinese Academy of Sciences

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Wu Di

Chinese Academy of Sciences

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Zhou Yizhou

Chinese Academy of Sciences

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Zhou Benlian

Chinese Academy of Sciences

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Diao Yuan-Yun

Chinese Academy of Sciences

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Gao Liyin

Chinese Academy of Sciences

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Li Caifu

Chinese Academy of Sciences

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Li Shouxin

Chinese Academy of Sciences

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Wen Guomou

Chinese Academy of Sciences

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