H. Coffin

Manipulation of two-dimensional arrays of Si nanocrystals embedded in thin SiO2 layers by low energy ion implantation

In silicon nanocrystal based metal–oxide–semiconductor memory structures, tuning of the electron tunneling distance between the Si substrate and Si nanocrystals located in the gate oxide is a crucial requirement for the pinpointing of optimal device architectures. In this work it is demonstrated that this tuning of the “injection distance” can be achieved by varying the Si+ ion energy or the oxide thickness during the fabrication of Si nanocrystals by ultralow-energy silicon implantation. Using an accurate cross-section transmission electron microscopy (XTEM) method, it is demonstrated that two-dimensional arrays of Si nanocrystals cannot be positioned closer than 5 nm to the channel by increasing the implantation energy. It is shown that injection distances down to much smaller values (2 nm) can be achieved only by decreasing the nominal thickness of the gate oxide. Depth profiles of excess silicon measured by time-of-flight secondary ion mass spectroscopy and Si nanocrystal locations determined by XTEM ...

Effect of annealing environment on the memory properties of thin oxides with embedded Si nanocrystals obtained by low-energy ion-beam synthesis

The effect of annealing in diluted oxygen versus inert environment on the structural and electrical characteristics of thin silicon dioxide layers with embedded Si nanocrystals fabricated by very low-energy silicon implantation (1 keV) is reported. Annealing in diluted oxygen increases the thickness of the control oxide, improves the integrity of the oxide and narrows the size distribution of the nanocrystals without affecting significantly their mean size (∼2 nm). Strong charge storage effects at low gate voltages and enhanced charge retention times are observed through electrical measurements of metal-oxide-semiconductor capacitors. These results indicate that a combination of low-energy silicon implants and annealing in diluted oxygen allows for the fabrication of improved low-voltage nonvolatile memory devices.

Stress measurements of germanium nanocrystals embedded in silicon oxide

Ge nanocrystals embedded in thermal SiO2 on top of a Si substrate are investigated using Raman spectroscopy and transmission electron microscopy. We observe that the Raman peak frequency of the Ge nanocrystals is strongly affected by compressive stress. In the case of large particles for which the phonon confinement-induced Raman shift can be neglected, the stress is measured taking into account isotopic composition effects induced by the ion implantation process used to produce the nanocrystals. The stress is proposed to originate from a liquid–solid phase transition in Ge.

Oxidation of Si nanocrystals fabricated by ultralow-energy ion implantation in thin SiO2 layers

The effect of thermal treatments in nitrogen-diluted oxygen on the structural characteristics of two-dimensional arrays of Si nanocrystals (NCs) fabricated by ultralow-energy ion implantation (1 keV) in thin silicon dioxide layers is reported. The NC characteristics (size, density, and coverage) have been measured by spatially resolved electron-energy-loss spectroscopy by using the spectrum-imaging mode of a scanning transmission electron microscope. Their evolution has been studied as a function of thermal treatment duration at a temperature (900 °C) below the SiO2 viscoelastic point. An extended spherical Deal-Grove [J. Appl. Phys. 36, 3770 (1965)] model for self-limiting oxidation of embedded silicon NCs has been carried out. It proposes that the stress effects, due to oxide deformation, slow down the NC oxidation rate and lead to a self-limiting oxide growth. The model predictions show a good agreement with the experimental results. Soft oxidation appears to be a powerful way for manipulating the NC s...

Multi-dot floating-gates for nonvolatile semiconductor memories: Their ion beam synthesis and morphology

Scalability and performance of current flash memories can be improved substantially by replacing the floating polycrystalline-silicon gate by a layer of Si dots. Here, we present both experimental and theoretical studies on ion beam synthesis of multi-dot layers consisting of Si nanocrystals (NCs) embedded in the gate oxide. Former studies have suffered from the weak Z contrast between Si and SiO2 in transmission electron microscopy (TEM). This letter maps Si plasmon losses with a scanning TEM equipped with a parallel electron energy loss spectroscopy system. Kinetic Monte Carlo simulations of Si phase separation have been performed and compared with Si plasmon maps. Predicted and measured Si morphologies agree remarkably well, both change with increasing ion fluence from isolated NCs to spinodal pattern. However, the predicted fluences are lower than the experimental ones. We identify as the main reason of this discrepancy the partial oxidation of implanted Si by atmospheric humidity, which penetrates in...

Room-temperature quantum effect in silicon nanoparticles obtained by low-energy ion implantation and embedded in a nanometer scale capacitor

In this article, we present the room-temperature current-voltage characteristics of a nanometer scale (100×100nm2) metal-oxide-semiconductor capacitor containing few (less than 100) silicon nanoparticles. The layer of silicon nanoparticles is synthesized within the oxide of this capacitor by ultra low-energy ion implantation and annealing. Current fluctuations in the form of discrete current steps and sharp peaks appeared in the static and dynamic I(V) characteristics of the capacitor. These features have been associated to quantized charging and discharging of the nanoparticles and the resulting Coulomb interaction to the tunneling current.

Resonant Raman scattering of a single layer of Si nanocrystals on a silicon substrate

We report Raman spectra of a single layer of silicon nanoparticles, spatially ordered in SiO2 at a tunneling distance from a silicon substrate. This is achieved by exploiting effects which enhance the nanocrystal signal, while suppressing the substrate one. The method is applied to investigate the structure of ion-implantation-produced Si nanoparticles annealed under different conditions. The results, which are in good agreement with transmission electron microscopy data, are used to explain photoluminescence measurements.

Electrical properties of nanocontacts on silicon nanoparticles embedded in thin SiO2 synthesized by ultralow energy ion implantation

In this paper, we present the room temperature current-voltage characteristics of large (100×100μm2) and a nanoscale (100×100nm2) metal-oxide-semiconductor (MOS) capacitor containing few silicon nanocrystals. The layer of silicon crystals is synthesized within the oxide of this capacitor by ultralow energy ion implantation and annealing. Current fluctuations in the form of discrete current steps and sharp peaks are apparent in the static and dynamic I(V) characteristics of the capacitor. These features have been associated to quantized charging and discharging of the nanoparticles and the resulting Coulomb interaction to the tunneling current.

Evolution of Quantum Electronic Features with the Size of Silicon Nanoparticles Embedded in a SiO2 Layer Obtained by Low Energy Ion Implantation

In this paper, we have studied the evolution of quantum electronic features with the size of silicon nanoparticles embedded in an ultra-thin SiO2 layer. These nanoparticles were synthesized by ultralow energy (1 KeV) ion implantation and annealing. Their size was modified using the effect of annealing under slightly oxidizing ambient (N2+O2). Material characterization techniques including transmission electron microscopy (TEM) Fresnel imaging and spatially resolved electron energy loss spectroscopy (EELS) have been used to evaluate the effects of oxidation on structural characteristics of nanocrystal layer. Electrical transport characteristics have been measured on few (less than two hundred) nanoparticles by exploiting a nanoscale MOS capacitor as a probe. Top electrode of this nanoscale capacitor (100 nm x 100 nm) was patterned over the samples by electron-beam nanolithography. Room temperature I-V and I-t characteristics of these structures exhibit discrete current peaks which have been interpreted by quantized charging of the nanoparticles and electrostatic interaction between the trapped charges and the tunneling current. The effects of progressive oxidation on these current features have been studied and discussed.

Oxidation of Si nanocrystals fabricated by ultra-low energy ion implantation in thin SiO 2 layers

The effect of annealing in diluted oxygen on the structural characteristics of thin silicon dioxide layers with embedded Si nanocrystals fabricated by ultra-low energy ion implantation (1 keV) is reported. The nanocrystal characteristics (size, density, coverage) have been measured by spatially resolved Electron Energy Loss Spectroscopy using the spectrum-imaging mode of a Scanning Transmission Electron Microscope. Their evolution has been studied as a function of the annealing duration under N2+O2 at 900°C. An extended spherical Deal-Grove model for the self-limiting oxidation of embedded silicon nanocrystals has been carried out. It shows that stress effects, due to the deformation of the oxide, slows down the chemical oxidation rate and leads to a self-limiting oxide growth. The model predictions show a good agreement with the experimental results.