H. M. Wang

Crack-free thick AlGaN grown on sapphire using AlN/AlGaN superlattices for strain management

We report on an AlN/AlGaN superlattice approach to grow high-Al-content thick n+-AlGaN layers over c-plane sapphire substrates. Insertion of a set of AlN/AlGaN superlattices is shown to significantly reduce the biaxial tensile strain, thereby resulting in 3-μm-thick, crack-free Al0.2Ga0.8N layers. These high-quality, low-sheet-resistive layers are of key importance to avoid current crowding in quaternary AlInGaN multiple-quantum-well deep-ultraviolet light-emitting diodes over sapphire substrates.

Anisotropic structural characteristics of (112̄0) GaN templates and coalesced epitaxial lateral overgrown films deposited on (101̄2) sapphire

a-plane GaN templates and coalesced epitaxial lateral overgrown (ELOG) films on r-plane sapphire substrates were investigated by x-ray diffraction (XRD). The a-plane GaN templates were found to have [0001]-oriented stripe-features, which is related to anisotropic mosaicity. For the mosaic blocks, the mosaicity reached the largest and the smallest values along the [1100] and the [0001] directions. The ELOG procedure with the SiO2 mask stripes perpendicular to the [0001] direction limits the preferable growth along this direction, and thereby enhances the [1100] growth. This leads to large-area, featureless, a-plane GaN films for which the wing tilt and not the fine mosaic block size becomes the major XRD line-broadening mechanism.

AlN/AlGaN superlattices as dislocation filter for low-threading-dislocation thick AlGaN layers on sapphire

We report on an approach of using AlN/AlGaN superlattices (SLs) for threading-dislocation-density reduction to grow high quality thick AlGaN on sapphire. Using x-ray diffraction (XRD) measurements and etch pits counting by atomic force microscopy, we show that the insertion of AlN/AlGaN SLs suppresses the material mosaicity and decreases the threading dislocation density by two orders of magnitude, and then eliminates cracking. Dislocation densities deduced from the XRD results and those from chemical etching are in a good agreement.

Pulsed atomic-layer epitaxy of ultrahigh-quality AlxGa1−xN structures for deep ultraviolet emissions below 230 nm

In this letter, we report the pulsed atomic-layer epitaxy of ultrahigh-quality AlN epilayers and AlN/Al0.85Ga0.15N multiple quantum wells (MQWs) on basal plane sapphire substrates. Symmetric and asymmetric x-ray diffraction (XRD) measurements and room-temperature (RT) photoluminescence (PL) were used to establish the ultrahigh structural and optical quality. Strong band-edge RT PL at 208 and 228 nm was obtained from the AlN epilayers and the AlN/Al0.85Ga0.15N MQWs. These data clearly establish their suitability for sub-250-nm deep UV emitters.

Reduction of threading dislocation densities in AlN∕sapphire epilayers driven by growth mode modification

A strategy to reduce the density of threading dislocations (TDs) in AlN epilayers grown on sapphire substrates is reported. The TDs experience a redirection of their line orientation which is found to coincide with imposed increases in both of V/III ratio and overall flux rate leading to the formation of an internal subinterface delineated by the changes in dislocation orientation. Threading dislocations either experience large kinks and then redirect into threading orientation or form dipole half loops via annihilation of redirected threading segments of opposite sign with the latter leading to a significant dislocation density reduction. These phenomena can be accounted for by a transition of growth mode from atomic step flow to two-dimensional layer-by-layer growth which accompanies the imposed changes in V/III ratio and flux. As this occurs, macrosteps (several atomic layers thick) laterally overgrow pre-existing dislocation outcrops. Image forces initiate the redirection processes and create trailing...

Thermal management of AlGaN-GaN HFETs on sapphire using flip-chip bonding with epoxy underfill

Self-heating imposes the major limitation on the output power of GaN-based HFETs on sapphire or SiC. SiC substrates allow for a simple device thermal management scheme; however, they are about a factor 20-100 higher in cost than sapphire. Sapphire substrates of diameters exceeding 4 in are easily available but the heat removal through the substrate is inefficient due to its low thermal conductivity. The authors demonstrate that the thermal impedance of GaN based HFETs over sapphire substrates can be significantly reduced by implementing flip-chip bonding with thermal conductive epoxy underfill. They also show that in sapphire-based flip-chip mounted devices the heat spread from the active region under the gate along the GaN buffer and the substrate is the key contributor to the overall thermal impedance.

GaN homoepitaxy on freestanding (11̄00) oriented GaN substrates

We report homoepitaxial GaN growth on freestanding (1100) oriented (M-plane GaN) substrates using low-pressure metalorganic chemical vapor deposition. Scanning electron microscopy, atomic-force microscopy, and photoluminescence were used to study the influence of growth conditions such as the V/III molar ratio and temperature on the surface morphology and optical properties of the epilayers. Optimized growth conditions led to high quality (1100) oriented GaN epilayers with a smooth surface morphology and strong band-edge emission. These layers also exhibited strong room temperature stimulated emission under high intensity pulsed optical pumping. Since for III-N materials the (1100) crystal orientation is free from piezoelectric or spontaneous polarization electric fields, our work forms the basis for developing high performance III-N optoelectronic devices.

Pulsed atomic layer epitaxy of quaternary AlInGaN layers

In this letter, we report on a material deposition scheme for quaternary AlxInyGa1−x–yN layers using a pulsed atomic layer epitaxy (PALE) technique. The PALE approach allows accurate control of the quaternary layer composition and thickness by simply changing the number of aluminum, indium, and gallium pulses in a unit cell and the number of unit cell repeats. Using PALE, AlInGaN layers with Al mole fractions in excess of 40% and strong room-temperature photoluminescence peaks at 280 nm can easily be grown even at temperatures lower than 800 °C.

A New Selective Area Lateral Epitaxy Approach for Depositing a-Plane GaN over r-Plane Sapphire

We report a new epitaxy procedure for growing extremely low defect density a-plane GaN films over r-plane sapphire. By combining selective area growth through a SiO2 mask opening to produce high height to width aspect ratio a-plane GaN pillars and lateral epitaxy from their c-plane facets, we obtained fully coalesced a-plane GaN films. The excellent structural, optical and electrical characteristics of these selective area lateral epitaxy (SALE) deposited films make them ideal for high efficiency III-N electronic and optoelectronic devices.

Lateral Epitaxial Overgrowth of Fully Coalesced A-Plane GaN on R-Plane Sapphire

Fully coalesced epitaxial laterally overgrown a-plane GaN films were characterized for their structural and optical quality. The films had a very smooth surface with a root mean square roughness as low as 4.6 ? for a 5 ?m ? 5 ?m atomic force microscope scan area. They exhibited a wing tilt of only 0.27? and optically pumped stimulated emission, which establish their high structural and optical quality. These non-polar films are ideal for fabricating high-efficiency optoelectronic and electronic devices.