H. Seidel

Silicon angular rate sensor for automotive applications with piezoelectric drive and piezoresistive read-out

In this work a silicon angular rate sensor for automotive applications with a new architecture is presented. It is based on the vibrating tuning fork principle with excitation direction of the tines perpendicular to the wafer surface. This arrangement allows the design of tines with significant inertial masses which lead to substantial signal. The oscillation of the tines is excited by a piezoelectric drive using an AlN thin film layer. The angular rate to be measured causes a torsional oscillation of the stem. The torsional amplitude is proportional to the angular rate and is measured by a piezoresistive read-out structure. We use silicon bulk micromachining based on a new twofold SOI-technique.

Modal optimization and filtering in piezoelectric microplate resonators

A systematic design procedure to tailor the modal response of micro-resonators based on flexible plates with piezoelectric films is demonstrated. Sensors/actuators were designed by optimizing the surface electrode shapes in the plane dimensions. A numerical finite element procedure, which considers the effective surface electrode covering the piezoelectric film as a binary function on each element, has been implemented. Two design goals are considered: (i) optimized response (actuation or sensing) in a given mode; (ii) implementation of a modal transducer by filtering specific modes. For a given mode in a plate with arbitrary boundary conditions, our calculations allowed us to predict the top electrode layout reaching higher displacement in resonance than any other electrode design for the same structure. Microcantilevers and microbridges were fabricated and their modal response characterized by laser Doppler vibrometry. In comparison to a conventional square-shaped electrode, our experiments show that the implemented designs can increase the response in any desired resonant mode and simultaneously attenuate the contributions from other unwanted modes, by simply shaping the surface electrodes. Enhancement ratios as high as 42 dB, relative to a full-size electrode case, are demonstrated. The limitations imposed by the fabrication are also discussed.

Compensation of parasitic effects for a silicon tuning fork gyroscope

This paper refers to a silicon micromachined tuning fork gyroscope, which is driven via two piezoelectric thin film actuators. The device responds to an external angular rate by a torsional motion about its sensitive axis due to the Coriolis effect. The shear stress in the upper torsional stem, which is proportional to the angular rate, is detected via a piezoresistive readout structure. In addition to the wanted signal corresponding to the angular rate, there are unwanted contributions from the drive motion, e.g., from mechanical unbalances and from asymmetries of the piezoelectric excitation induced by fabrication tolerances. These effects, which disturb the sensor signal with varying contributions in amplitude and phase, have already been examined for capacitive surface micromachined sensors. In this paper, they are identified for a piezoelectrically driven, bulk-micromachined gyro and compared to results of FEM simulations. System-level simulations are performed and show possibilities to compensate the main parasitic effects. Results of eliminating the mechanical unbalance by femtosecond laser trimming are presented and compared with the simulations

Characterization and simulation of the first extensional mode of rectangular micro-plates in liquid media

This Letter reports on the characterization of the first extensional mode of AlN-actuated mid-point supported resonant microplates in liquid media. Devices of different dimensions were fabricated and both optical and electrical measurements were performed in order to identify the modal shape under study and determine its quality factor. The dependence of the quality factor on the plate dimensions is discussed based on analytical and finite element simulation results. A quality factor of 100 was achieved in water at 3.8 MHz, and the suitability of this kind of device to work under high viscous condition (up to 51 cP) was demonstrated.

Evaluation of resonating Si cantilevers sputter-deposited with AlN piezoelectric thin films for mass sensing applications

We report on a micro-machined resonator for mass sensing applications which is based on a silicon cantilever excited with a sputter-deposited piezoelectric aluminium nitride (AlN) thin film actuator. An inductively coupled plasma (ICP) cryogenic dry etching process was applied for the micro-machining of the silicon substrate. A shift in resonance frequency was observed, which was proportional to a mass deposited in an e-beam evaporation process on top. We had a mass sensing limit of 5.2 ng. The measurements from the cantilevers of the two arrays revealed a quality factor of 155–298 and a mass sensitivity of 120.34 ng Hz−1 for the first array, and a quality factor of 130–137 and a mass sensitivity of 104.38 ng Hz−1 for the second array. Furthermore, we managed to fabricate silicon cantilevers, which can be improved for the detection in the picogram range due to a reduction of the geometrical dimensions.

RF-MEMS Switch and Phase Shifter Optimized for W-Band

This paper presents the optimization of the low-complexity RF-MEMS technology for W-Band, the fabricated switches and phase shifters. All devices are fabricated on a thinned silicon substrate using only one metallization. The basic W-Band switch used for the phase shifter is presented in detail showing a very wide band RF-behaviour with an almost constant insertion loss of about -0.3 dB from 50 - 100 GHz. The 3-bit phase shifter itself with the design frequency of 76.5 GHz is realized using one loaded-line and two switched-line phase shifter elements. The mean insertion loss of the whole phase shifter is -5.3 dB and the phase deviation was calculated to be 13.4deg. Furthermore an extension to a 4-bit phase shifter by the use of a dual-state microstrip line phase shifter element is given. In addition, a short switching-time of the switches of only 15 mus was measured.

Surface plasmon polariton model of high-spatial frequency laser-induced periodic surface structure generation in silicon

In recent years, high-spatial frequency laser-induced surfaces structures have been generated in a large variety of dielectrics. In silicon subwavelength ripples, some of which featured periodicities below 100 nm, were formed using ultrafast lasers. We demonstrate for Si(100) surfaces that generation of a dense electron-hole plasma in the focal spot of ultrashort-pulsed laser light followed by massive excitation of plasma waves provides an explanation for the formation of such high-spatial frequency surface structures. The applied Drude-like model includes carrier-carrier collisions and is in excellent agreement with the experimentally observed ripple period.

Sub-100 nm structuring of indium-tin-oxide thin films by sub-15 femtosecond pulsed near-infrared laser light

In magnetron sputtered indium-tin-oxide thin films of varying oxygen content, nanostructures were formed using tightly focused high-repetition rate near-infrared sub-15 femtosecond pulsed laser light. At radiant exposure well beyond the ablation threshold, cuts of 280-350 nm in width were generated. Illumination close to the ablation threshold resulted in periodic cuts of typically 20 nm in width at periodicities between 50 nm and 180 nm, as well as single sub-20 nm cuts. Subthreshold exposure, in combination with hydrochloric acid etching, yielded nanowires of 50 nm minimum lateral dimensions.

Sub-100 nm material processing and imaging with a sub-15 femtosecond laser scanning microscope

Low mean powers of 1–10 mW are sufficient for material nanoprocessing when using femtosecond laser microscopes. In particular, near infrared 12 fs laser pulses at peak TW/cm2 intensities, picojoule pulse energies, and 85 MHz repetition rate have been employed. Three-dimensional two-photon lithography as well as direct multiphoton ablation have been performed. Subwavelength sub-100 nm cuts have been realized in photoresists, silicon wafers, glass, polymers, metals, and biological targets. When reducing the mean power to the microwatt range, nondestructive two-photon imaging was performed with the same setup taking advantage of the broad laser emission spectrum. Multiphoton microscopes based on low-cost ultracompact sub-20 fs laser sources may become novel nonlinear optical tools for highly precise nanoprocessing and two-photon imaging.

A new capacitive type MEMS microphone

A new capacitive type of MEMS microphone is presented. In contrast to existing technologies which are highly specialized for this particular type of application, our approach is based on a standard process and layer system which has been in use for more than a decade now for the manufacturing of inertial sensors. For signal conversion, a mixed-signal ASIC with digital sampling of the microphone capacitance is used. The MEMS microphone yields high signal-to-noise performance (58 dB) after mounting it in a standard LGA-type package. It is well-suited for a wide range of potential applications and demonstrates the universal scope of the used process technology.