H.Y. Zhao

Temperature and stress fields of multi-track laser cladding

Based on genetic algorithm and neural network algorithm, the finite element analyses on the temperature fields and stress fields of multi-track laser cladding were carried out by using the ANSYS software. The results show that, in the multi-track cladding process, the temperature field ellipse leans to the cladding formed, and the front cladding has preheating function on the following cladding. During cladding, the longitudinal stress is the largest, the lateral stress is the second, and the thickness direction stress is the smallest. The center of the cladding is in the tensile stress condition. The longitudinal tensile stress is higher than the lateral or thickness direction stress by several times, and the tensile stress achieves the maximum at the area of joint between the cladding and substrate. Therefore, it is inferred that transversal crack is the most main crack form in multi-track laser cladding. Moreover, the joint between cladding and substrate is the crack sensitive area, and this is consistent with the actual experiments.

Prediction of vulnerable zones based on residual stress and microstructure in CMT welded aluminum alloy joint

Abstract Numerical simulation and experimental results were employed for the identification of the most vulnerable zones in three-pass cold-metal-transferring (CMT) welded joint. The residual stress distribution in the joint was predicted by finite element (FE) method, while the structural morphology of distinctive zones was obtained through metallographic experiments. The highest principal stress made the symmetric face of the joint most sensitive to tensile cracks under service conditions. Whereas, the boundaries between the weld seam and the base plates were sensitive to cracks because the equivalent von Mises stress was the highest when the first interpass cooling was finished. The third weld pass and the inter-pass remelted zones exhibited the modest mechanical performances as a result of the coarse grain and coarse grain boundary, respectively. The most vulnerable zones were regarded to be the crossed parts between the zones identified by numerical and experimental methods.

Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process

Homogeneous (Cu, Ni)6Sn5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system consisted of major (Cu, Ni)6Sn5 and minor Cu3Sn IMCs, and the grain morphology of (Cu, Ni)6Sn5 IMCs subsequently exhibited fine rounded, needlelike and coarse rounded shapes from the Ni side to the Cu side, which was highly in accordance with the Ni concentration gradient across the joints. However, in the ultrasound-induced TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu system only consisted of the (Cu, Ni)6Sn5 IMCs which exhibited an uniform grain morphology of rounded shape with a remarkably narrowed Ni concentration gradient. The ultrasound-induced homogeneous intermetallic joints exhibited higher shear strength (61.6 MPa) than the traditional heterogeneous intermetallic joints (49.8 MPa).