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Hable Wolfram

Infineon Technologies

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Publication

Featured researches published by Hable Wolfram.

Archive | 2003

Leistungsmodul mit mindestens zwei Substraten und Verfahren zu seiner Herstellung

Hable Wolfram

Archive | 2003

Leistungsmodul und Verfahren zu seiner Herstellung

Hable Wolfram

Archive | 2012

MULTI-CHIP PACKAGE

Hable Wolfram

Archive | 2018

Mit Kühlfluid gekühlte und eine Abschirmschicht umfassende Packung

Grassmann Andreas; Hoegerl Juergen; Nikitin Ivan; Hable Wolfram; Strass Achim

Archive | 2018

Package cooled with cooling fluid and comprising shielding layer

Grassmann Andreas; Hable Wolfram; Hoegerl Juergen; Nikitin Ivan; Strass Achm

Archive | 2018

Packung mit teilweise gekapseltem Kühlkanal zum Kühlen eines gekapselten Chips

Nikitin Ivan; Grassmann Andreas; Hable Wolfram; Strass Achim

Archive | 2018

Package with partially encapsulated cooling channel for cooling an encapsulated chip

Grassmann Andreas; Hable Wolfram; Hoegerl Juergen; Nikitin Ivan; Strass Achim

Archive | 2017

Halbleiterchipgehäuse, das sich lateral erstreckende Anschlüsse umfasst

Hable Wolfram; Gruber Martin

Archive | 2017

SEMICONDUCTOR CHIP PACKAGE COMPRISING LATERALLY EXTENDING CONNECTORS

Hable Wolfram; Gruber Martin; Hoegerl Juergen

Archive | 2016

Electronic module comprising fluid cooling channel and method of manufacturing the same

Fuergut Edward; Gruber Martin; Hable Wolfram

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Collaboration

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Grassmann Andreas

Infineon Technologies

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Gruber Martin

Infineon Technologies

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Hoegerl Juergen

Infineon Technologies

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Nikitin Ivan

Infineon Technologies

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Strass Achim

Infineon Technologies

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Fuergut Edward

Infineon Technologies

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Geitner Ottmar

Infineon Technologies

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Schwarz Alexander

Infineon Technologies

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Winter Frank

Infineon Technologies

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Herbrandt Alexander

Infineon Technologies

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