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Han-Ping Pu

Siliconware Precision Industries Company, Ltd.

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Publication

Featured researches published by Han-Ping Pu.

Archive | 2002

Module device of stacked semiconductor packages and method for fabricating the same

Han-Ping Pu; Chih-Ming Huang; Chien-Ping Huang

Archive | 2006

Stacked semiconductor structure and fabrication method thereof

Chien-Ping Huang; Chih-Ming Huang; Han-Ping Pu; Yu-Po Wang; cheng-Hsu Hsiao

Archive | 2007

Chip scale package structure with metal pads exposed from an encapsulant

Han-Ping Pu; Chien-Ping Huang; cheng-Hsu Hsiao

Archive | 2007

Chip scale package structure and method for fabricating the same

Han-Ping Pu; Chien-Ping Huang; cheng-Hsu Hsiao

Archive | 2010

METHOD OF FABRICATING STACKED SEMICONDUCTOR STRUCTURE

Chien-Ping Huang; Chih-Ming Huang; Han-Ping Pu; Yu-Po Wang; cheng-Hsu Hsiao

Archive | 2006

Semiconductor package having heat dissipating device with cooling fluid

Han-Ping Pu; Chien-Ping Huang; cheng-Hsu Hsiao

Archive | 2003

Fabrication method for ball grid array semiconductor package

Han-Ping Pu; Chien-Ping Huang; Chih-Ming Huang

Archive | 2003

Method of fabricating BGA packages

Han-Ping Pu; Chien-Ping Huang; Chih-Ming Huang

Archive | 2010

Method for fabricating chip scale package structure with metal pads exposed from an encapsulant

Han-Ping Pu; Chien-Ping Huang; cheng-Hsu Hsiao

Archive | 2010

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING HEAT DISSIPATION DEVICE

Han-Ping Pu; Chien-Ping Huang; cheng-Hsu Hsiao

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