Hans-Juergen Hacke

Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements

Flexible wiring for the transformation of a substrate with edge contacts into a ball grid array

Chip module for chip card used as telephone or identification card

ASSEMBLY PROCESS FOR PRODUCING LED ROWS

Solder bead application system for substrate termination surfaces

Method for transforming a substrate with edge contacts into a ball grid array, ball grid array manufactured according to this method, and flexible wiring for the transformation of a substrate with edge contacts into a ball grid array

Method for transforming a substrate with edge contacts into a ball grid array

Process for the production of printed circuits with solder rejecting sub-zones

Elektronisches Chipbauteil mit einer integrierten Schaltung und Verfahren zur Herstellung An electronic chip component with an integrated circuit and methods for making

An electronic chip component with an integrated circuit and methods for making